公开(公告)号：US20030022424A1

公开(公告)日：2003-01-30

申请号：US10193972

申请日：2002-07-12

Applicant: GLIMMERGLASS NETWORKS, INC.

Inventor： Bryan P. Staker ,  Douglas L. Teeter ,  Eric L. Bogatin

IPC: H01L021/31

CPC classification number: B81B7/0006 ,  G02B6/3518 ,  G02B6/357 ,  G02B6/3582 ,  G02B6/3584 ,  G02B2006/12104

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract translation: 阵列装置具有微机械加工SOI结构，例如MEMS阵列，其直接安装在一类绝缘基底上，例如低温共烧陶瓷或热膨胀系数匹配玻璃，其中嵌入静电电极 与各个MEMS元件对准，其中静电电极被配置为实质上扇出。 在一个具体实施例中，为了补偿SOI和陶瓷之间的热膨胀特性的差异，通过柱，桥和/或机械元件实现柔性安装，其允许x和y中的不均匀膨胀，同时保持z轴稳定性 。 根据本发明的方法包括制造步骤，其中电极被制造成后烧制陶瓷衬底，并且经由陶瓷衬底的迹线耦合到驱动器模块。