公开(公告)号：US20030022424A1

公开(公告)日：2003-01-30

申请号：US10193972

申请日：2002-07-12

Applicant: GLIMMERGLASS NETWORKS, INC.

Inventor： Bryan P. Staker ,  Douglas L. Teeter ,  Eric L. Bogatin

IPC: H01L021/31

CPC classification number: B81B7/0006 ,  G02B6/3518 ,  G02B6/357 ,  G02B6/3582 ,  G02B6/3584 ,  G02B2006/12104

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of insulative substrate, such as low temperature co-fired ceramic or a thermal-coefficient of expansion matched glass, in which is embedded electrostatic electrodes disposed in alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout. In a specific embodiment in order to compensate for differences in thermal-expansion characteristics between SOI and ceramic, a flexible mounting is effected by means of posts, bridges and/or mechanical elements which allow uneven expansion in x and y while maintaining z-axis stability. Methods according to the invention include fabrication steps wherein electrodes are fabricated to a post-fired ceramic substrate and coupled via traces through the ceramic substrate to driver modules.

Abstract translation: 阵列装置具有微机械加工SOI结构，例如MEMS阵列，其直接安装在一类绝缘基底上，例如低温共烧陶瓷或热膨胀系数匹配玻璃，其中嵌入静电电极 与各个MEMS元件对准，其中静电电极被配置为实质上扇出。 在一个具体实施例中，为了补偿SOI和陶瓷之间的热膨胀特性的差异，通过柱，桥和/或机械元件实现柔性安装，其允许x和y中的不均匀膨胀，同时保持z轴稳定性 。 根据本发明的方法包括制造步骤，其中电极被制造成后烧制陶瓷衬底，并且经由陶瓷衬底的迹线耦合到驱动器模块。

公开(公告)号：US20040095629A1

公开(公告)日：2004-05-20

申请号：US10700734

申请日：2003-11-03

Applicant: Glimmerglass Networks, Inc.

Inventor： Bryan P. Staker ,  Lawrence P. Muray ,  Andres Fernandez

IPC: G02F001/03 ,  G02F001/07

CPC classification number: G02B26/0841 ,  B81B3/0086 ,  B81B2201/042

Abstract: In an electrostatically controlled deflection apparatus, such as a MEMS array having cavities formed around electrodes and which is mounted directly on a dielectric or controllably resistive substrate in which are embedded electrostatic actuation electrodes disposed in alignment with the individual MEMS elements, a mechanism is provided to mitigate the effects of uncontrolled dielectric surface potentials between the MEMS elements and the electrostatic actuation electrodes, the mechanism being raised electrodes relative to the dielectric or controllably resistive surface of the substrate. The aspect ratio of the gaps between elements (element height to element separation ratio) is at least 0.1 and preferably at least 0.5 and preferably between 0.75 and 2.0 with a typical choice of about 1.0, assuming a surface fill factor of 50% or greater. Higher aspect ratios at these fill factors are believed not to provide more than marginal improvement.

Abstract translation: 在静电控制的偏转装置中，例如具有围绕电极形成的空腔的MEMS阵列，其直接安装在电介质或可控电阻衬底上，其中嵌入的静电致动电极与各个MEMS元件对齐设置， 减轻MEMS元件和静电致动电极之间不受控制的电介质表面电位的影响，该机构是相对于基板的电介质或可控制的电阻表面而升高的电极。 假设表面填充因子为50％以上，元件之间的间隙（元件高度与元素分离比）的纵横比为至少0.1，优选为至少0.5，优选为0.75至2.0，典型的选择为约1.0。 这些填充因子的较高纵横比被认为不能提供更多的边际改进。

公开(公告)号：US20040001263A1

公开(公告)日：2004-01-01

申请号：US10625883

申请日：2003-07-22

Applicant: Glimmerglass Networks, Inc.

Inventor： Bryan P. Staker ,  James P. Spallas ,  Lawrence P. Muray ,  Andres Femandez

IPC: G02B007/182

CPC classification number: B81B3/0051 ,  B81B2201/042 ,  G02B26/0841

Abstract: A MEMS device having a fixed element and a movable element wherein one or the other of the fixed element and the movable element has at least one radially-extended stop or overdeflection limiter. A fixed overlayer plate forms an aperture. The aperture is sized to minimize vignetting and may be beveled on the margin. Overdeflection limitation occurs during deflection before the movable element can impinge on an underlying electrode. The overdeflection limiter may be conveniently placed adjacent a gimbaled hinge.

公开(公告)号：US20040071393A1

公开(公告)日：2004-04-15

申请号：US10271668

申请日：2002-10-15

Applicant: Glimmerglass, Networks Inc.

Inventor： Bryan P. Staker ,  Eugene W. Campbell ,  Paul H. Pax

IPC: G02B006/35

CPC classification number: G02B6/356 ,  G02B6/3556 ,  G02B6/357

Abstract: In a folded three-dimensional free-space optical switch including a set of fibers and an optical system for producing collimated beamlets aligned to intersect an array of dual axis micromirrors of coplanar input and output mirror elements, and a folding mirror, the input and output micromirrors are arranged in a pattern wherein either the input or output mirror set is disposed along an annulus and wherein the complementary output or input mirror set is disposed within the annulus in order to globally minimize maximum tilt angles for a two-dimensional locus of tilt angles of the micromirror set. The beamlets are routed from assigned input fibers to corresponding input moveable mirrors to assigned output fibers via the static folding mirror and corresponding output moveable mirrors.

Abstract translation: 在包括一组光纤的折叠的三维自由空间光学开关和用于产生准直的子束的光学系统的光学系统中，所述准直子束被对齐以与共面输入和输出反射镜元件的双轴微镜阵列和折叠镜相交，所述输入和输出 微镜以其中输入或输出反射镜组沿着环形布置的图案布置，并且其中互补输出或输入反射镜组设置在环形空间内，以便全局地最小化倾斜角度的二维轨迹的最大倾斜角度 的微镜组。 子束从分配的输入光纤路由到相应的输入可移动反射镜，经由静态折叠镜和相应的输出可移动反射镜分配给输出光纤。

公开(公告)号：US20030020585A1

公开(公告)日：2003-01-30

申请号：US09918897

申请日：2001-07-30

Applicant: GlimmerGlass Networks, Inc.

Inventor： Bryan P. Staker ,  Douglas L. Teeter JR. ,  Thomas A. DeBey ,  David T. Amm

IPC: H01F005/00

CPC classification number: H01H59/0009

Abstract: An array apparatus has a micromachined SOI structure, such as a MEMS array, mounted directly on a class of substrate, such as low temperature co-fired ceramic, in which is embedded electrostatic actuation electrodes disposed in substantial alignment with the individual MEMS elements, where the electrostatic electrodes are configured for substantial fanout and the electrodes are oversized such that in combination with the ceramic assembly are configured to allow for placement of the vias within a tolerance of position relative to electrodes such that contact is not lost therebetween at the time of manufacturing.

Abstract translation: 阵列装置具有微加工SOI结构，例如MEMS阵列，其直接安装在一类基底上，例如低温共烧陶瓷，​​其中嵌入的静电致动电极与各个MEMS元件基本对齐，其中 静电电极被配置为实质上扇出并且电极尺寸过大，使得与陶瓷组件结合使得能够将通孔放置在相对于电极的位置公差范围内，使得在制造时不会在其间失去接触 。