公开(公告)号：WO2017131888A1

公开(公告)日：2017-08-03

申请号：PCT/US2016/067018

申请日：2016-12-15

Applicant: GOOGLE INC.

Inventor： COOPER, James ,  LILJE, Joshua Norman

IPC: H05K9/00 ,  B29C70/88

CPC classification number: G06F1/1658 ,  H05K3/321 ,  H05K9/0022 ,  H05K9/0032

Abstract: An electronic device may include a printed circuit board (PCB) including at least one electronic component, and an electrically conductive enclosure surrounding the at least one electronic component to provide electromagnetic interference (EMI) shielding for the at least one component. The electrically conductive enclosure may include a frame, made of a resilient, electrically conductive material, on a mounting surface of the PCB, surrounding the at least one component, and an electrically conductive shielding cover extending across an open top area defined by the frame. The frame may be attached to the PCB and the cover by an electrically conductive material to provide for electrical continuity. The frame may be made of a resilient, electrically conductive material so that the frame may compress in response to an externally applied force, and may return to an original, non-compressed form upon removal of the externally applied force.

Abstract translation: 电子设备可以包括包括至少一个电子部件的印刷电路板（PCB）以及围绕所述至少一个电子部件的导电外壳，以为所述电子部件提供电磁干扰（EMI）屏蔽 至少有一个组件。 导电外壳可以包括框架，该框架由弹性导电材料制成，在PCB的安装表面上，围绕该至少一个部件，以及导电屏蔽罩，其延伸跨过由框架限定的敞开的顶部区域。 框架可以通过导电材料附接到PCB和盖以提供电连续性。 框架可以由弹性的导电材料制成，使得框架可以响应于外部施加的力而压缩，并且可以在移除外部施加的力时返回到原始的非压缩形式。

公开(公告)号：WO2017066302A1

公开(公告)日：2017-04-20

申请号：PCT/US2016/056612

申请日：2016-10-12

Applicant: GOOGLE INC.

Inventor： COOPER, James ,  LILJE, Joshua Norman

IPC: H05K9/00 ,  H01L23/552 ,  H01L23/36 ,  H01L23/367 ,  H01L23/373

CPC classification number: H05K1/0203 ,  H01L23/36 ,  H01L23/3672 ,  H01L23/373 ,  H01L23/427 ,  H01L23/552 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/111 ,  H05K1/181 ,  H05K3/303 ,  H05K3/321 ,  H05K2201/0323 ,  H05K2201/064 ,  H05K2201/0707 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: An electronic device includes a printed circuit board (PCB), the PCB including at least one grounding pad, an integrated circuit mounted on the PCB; an electrically conductive frame mounted on the PCB and surrounding the integrated circuit, the frame being electrically connected to the at least one grounding pad, and a pliant electrically conductive, high-thermal-conductivity heat spreader in electrical contact with the frame and in thermal contact with the integrated circuit. The frame, the heat spreader, and the at least one grounding pad form an EMI shield that reduces EMI leakage from the integrated circuit outside a volume defined by the frame, the heat spreader, and the at least one grounding pad.

Abstract translation: 一种电子设备，包括印刷电路板（PCB），所述PCB包括至少一个接地焊盘，安装在所述PCB上的集成电路; 安装在所述PCB上并包围所述集成电路的导电框架，所述框架电连接到所述至少一个接地垫;以及柔性导电高导热散热器，与所述框架电接触并且处于热接触 与集成电路。 框架，散热器和至少一个接地垫形成EMI屏蔽，其减少了由框架，散热器和至少一个接地垫限定的体积之外的来自集成电路的EMI泄漏。