VARIABLE PITCH ELECTRONIC COMPONENT MASS TRANSFER APPARATUS AND METHOD

    公开(公告)号:US20210219476A1

    公开(公告)日:2021-07-15

    申请号:US17218367

    申请日:2021-03-31

    Abstract: A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.

    RAPID ACTIVE VIBRATION REDUCTION METHOD FOR HIGH-SPEED MOTION STAGE

    公开(公告)号:US20230235810A1

    公开(公告)日:2023-07-27

    申请号:US18154533

    申请日:2023-01-13

    Abstract: A rapid active vibration reduction method for a high-speed motion stage includes acquiring motion parameters of a motion body of the motion stage in current motion; determining a vibration reduction mode of a vibration reduction device according to the motion parameters; and controlling an action end of the vibration reduction device to contact with the motion body of the motion stage or contact with a driving device for driving the motion body to move based on the vibration reduction mode, so that a contact friction force used for suppressing vibration of the motion body is generated. Realizing vibration reduction by means of active friction can reduce vibration of the motion body in a specific stage needing vibration reduction, and the action end of the vibration reduction device does not need to contact with the motion body or does not need to contact with the driving device before vibration reduction.

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