公开(公告)号：US20210219476A1

公开(公告)日：2021-07-15

申请号：US17218367

申请日：2021-03-31

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xin CHEN ,  Yunbo HE ,  Xiquan MAI ,  Chengqiang CUI ,  Qiang LIU ,  Jian GAO ,  Zhijun YANG ,  Xun CHEN ,  Yun CHEN ,  Kai ZHANG ,  Hui TANG ,  Yu ZHANG

IPC: H05K13/04 ,  H01L33/00 ,  H01L33/62

Abstract: A variable pitch electronic component mass transfer apparatus is disclosed. A die-bond transfer head is disposed below each of the die-bond brackets. The die-bond connecting rod is provided with die-bond movable nodes arranged equidistantly. Each of the die-bond movable node is hinged to one of the die-bond brackets. An output end of the die-bond linear motor drives the die-bond connecting rod to move telescopically. A flip-chip transfer head is disposed below each of the flip-chip brackets. The flip-chip connecting rod is provided with flip-chip movable nodes arranged equidistantly. Each of the flip-chip movable nodes is hinged to one of the flip-chip brackets. An output end of the flip-chip linear motor drives the flip-chip connecting rod to move telescopically. An output end of the connecting rod rotating motor is connected to the flip-chip rail, and is configured to turn over the flip-chip rail.

公开(公告)号：US20230298914A1

公开(公告)日：2023-09-21

申请号：US18062026

申请日：2022-12-06

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Hui TANG ,  Zhishen LIAO ,  Xin CHEN ,  Zhihang LIN ,  Jian GAO ,  Qiang LIU ,  Xun CHEN

IPC: H01L21/67

CPC classification number: H01L21/67144 ,  H01L21/67259

Abstract: A compliant mechanical system for Mini/Micro chip mass transfer and packaging comprises a flexure-based continuous ejector pin mechanism including a drive support plate, a mounting base, first thorn die attach drive devices, second thorn die attach drive devices, first flexible hinges, second flexible hinges, and a pricking pin. The first thorn die attach drive devices and the second thorn die attach drive devices are mounted on the drive support plate. A drive end of the first thorn die attach drive device horizontally passes rightward through the first flexible hinge at a corresponding position; a drive end of the second thorn die attach drive device horizontally passes leftward through the first flexible hinge at a corresponding position; and the mounting base is hinged to the drive ends of the two thorn die attach drive devices through the second flexible hinges.

公开(公告)号：US20230268205A1

公开(公告)日：2023-08-24

申请号：US18062025

申请日：2022-12-06

Applicant: GUANGDONG UNIVERSITY OF TECHNOLOGY

Inventor： Xin CHEN ,  Zhihang LIN ,  Hui TANG ,  Hongcheng LI ,  Jian GAO ,  Qiang LIU ,  Xun CHEN

IPC: H01L21/67 ,  H01L33/00

CPC classification number: H01L21/67144 ,  H01L33/0093

Abstract: A flexure-based continuous ejector pin mechanism for Mini/Micro chip mass transfer includes a first drive frame, a second drive frame, a mounting base, a first thorn die attach drive device, a second thorn die attach drive device, first flexible hinges, second flexible hinges, and a pricking pin. The second drive frame and the first drive frame are connected through the first flexible hinge. The mounting base is connected to a left side and a right side of the second drive frame through the second flexible hinges. Compared with a laser transfer technology, the flexible movable thorn die attach device has lower cost and higher accuracy; compared with a vacuum nozzle transfer technology, the flexible movable thorn die attach device has higher transfer efficiency and quality; and compared with a conventional thorn die attach device, the flexible movable thorn die attach device has higher transfer efficiency and precision.