公开(公告)号：EP1141887B1

公开(公告)日：2003-02-05

申请号：EP99973502.0

申请日：1999-11-29

Applicant: Gemplus

Inventor： ODDOU, Laurent ,  AYALA, Stéphane ,  ZAFRANY, Micha[l

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L24/24 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/09772 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention concerns a method for making a contactless chip card comprising an electronic module (600), and connected to said module, an antenna (200). The inventive method comprises the following steps: producing, on a first support sheet (100), the antenna (200) provided at its ends, with connection terminals (250); producing an insulating bridge (300) partly covering the antenna (200) coils except for the connection terminals (250); depositing a drop of filling material (500) on the insulating bridge; transferring the electronic module (600), its connection pads (610) being oriented towards the insulating bridge (300); then providing an electric connection between the module (600) contact pads and the antenna (200) connection terminals (250).

公开(公告)号：EP1084482A1

公开(公告)日：2001-03-21

申请号：EP99923643.3

申请日：1999-05-31

Applicant: Gemplus

Inventor： FIDALGO, Jean, Christophe ,  ELBAZ, Didier ,  ZAFRANY, Micha[l ,  PATRICE, Philippe

IPC: G06K19/077

CPC classification number: G06K19/07747 ,  G06K19/07743 ,  G06K19/07745 ,  H01L21/56 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49855 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/24226 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: The invention relates to a method for producing an integrated circuit, including a step whereby a module (12) is created and fixed on the body of a card (20) and provided with an integrated circuit (14) and contact pads (16). The invention is characterised in that the step in which the module (12) is created comprises a stage that consists in forming slots in a plate element (26) that is made from a conducting material, whereby said slots define at least partially the areas of the plate element (20) that will form the contact pads. The invention is also characterised by a subsequent step that consists in coating a lower face (32) of the plate element at least partially with adhesive matter (30) to enable the module (12) to be fixed to the body of the card (20) at a later stage.

公开(公告)号：EP1141887A1

公开(公告)日：2001-10-10

申请号：EP99973502.0

申请日：1999-11-29

Applicant: Gemplus

Inventor： ODDOU, Laurent ,  AYALA, Stéphane ,  ZAFRANY, Micha[l

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H01L24/24 ,  H01L2224/83192 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/181 ,  H05K3/28 ,  H05K3/284 ,  H05K3/305 ,  H05K2201/09772 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10S257/922 ,  H01L2924/00

Abstract: The invention concerns a method for making a contactless chip card comprising an electronic module (600), and connected to said module, an antenna (200). The inventive method comprises the following steps: producing, on a first support sheet (100), the antenna (200) provided at its ends, with connection terminals (250); producing an insulating bridge (300) partly covering the antenna (200) coils except for the connection terminals (250); depositing a drop of filling material (500) on the insulating bridge; transferring the electronic module (600), its connection pads (610) being oriented towards the insulating bridge (300); then providing an electric connection between the module (600) contact pads and the antenna (200) connection terminals (250).