公开(公告)号：EP3248226B1

公开(公告)日：2020-02-26

申请号：EP15907618.1

申请日：2015-11-04

Applicant: Goertek Inc.

Inventor： ZOU, Quanbo ,  LU, Manen ,  WANG, Zhe

IPC: H01L33/00 ,  H01L33/20

公开(公告)号：EP3248226A1

公开(公告)日：2017-11-29

申请号：EP15907618.1

申请日：2015-11-04

Applicant: Goertek Inc.

Inventor： ZOU, Quanbo ,  LU, Manen ,  WANG, Zhe

IPC: H01L33/00

Abstract: The present invention discloses a transferring method, a manufacturing method, a device and an electronics apparatus of micro-LED. The method for transferring micro-LEDs comprises: forming a mask layer on the backside of a laser-transparent original substrate, wherein micro-LEDs are formed on the front-side of the original substrate; bringing the micro-LEDs on the original substrate in contact with preset pads on a receiving substrate; and irradiating the original substrate from the original substrate side with laser through the mask layer, to lift-off micro-LEDs from the original substrate.