公开(公告)号：US09664569B2

公开(公告)日：2017-05-30

申请号：US14714005

申请日：2015-05-15

Applicant: Google Inc.

Inventor： Adam Mittleman ,  Ian Charles Smith ,  Daniel Adam Warren ,  William Raeming Dong ,  Jeff Wheeler

IPC: G01N21/00 ,  G01J5/06 ,  H05K1/02 ,  G01J5/00 ,  G01J5/10 ,  G01J5/02 ,  G01J5/04 ,  G08B13/189

CPC classification number: G01J5/06 ,  G01J5/0014 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/10 ,  G08B13/189 ,  G08B13/191 ,  H05K1/0201 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10575 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

公开(公告)号：US20160334279A1

公开(公告)日：2016-11-17

申请号：US14714005

申请日：2015-05-15

Applicant: Google Inc.

Inventor： Adam Mittleman ,  Ian Charles Smith ,  Daniel Adam Warren ,  William Raeming Dong ,  Jeff Wheeler

IPC: G01J5/06 ,  G01J5/00 ,  G01J5/10 ,  H05K1/02

CPC classification number: G01J5/06 ,  G01J5/0014 ,  G01J5/0205 ,  G01J5/04 ,  G01J5/10 ,  G08B13/189 ,  G08B13/191 ,  H05K1/0201 ,  H05K1/0298 ,  H05K2201/09063 ,  H05K2201/093 ,  H05K2201/09363 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10522 ,  H05K2201/10575 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A multilayered circuit board having a metal-free region vertically extending through at least a portion of a conductive layer, which lies generally parallel to a horizontal plane, vertically spaced from an outer surface. Heat-emitting and heat-sensitive components are mounted on the outer surface. The heat-emitting component is vertically and laterally spaced from the metal-free region, whereas the heat-sensitive component is vertically spaced and laterally aligned within the metal-free region such that the metal-free region is a thermal barrier that shields heat-sensitive component from radial heat flowing from the heat-emitting component.

Abstract translation: 一种多层电路板，其具有垂直延伸穿过导电层的至少一部分的无金属区域，该导电层大致平行于与外表面垂直间隔的水平平面。 发热和热敏元件安装在外表面上。 发热部件与无金属区域垂直和横向间隔开，而热敏部件在无金属区域内垂直间隔开并横向对准，使得无金属区域是屏蔽热 - 来自发热部件的径向热的敏感部件。