Abstract:
In various embodiments, electronic devices such as thin-film transistors and/or touch-panel displays incorporate electrodes and/or interconnects featuring a conductor layer and, disposed above or below the conductor layer, a capping layer and/or a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
Abstract:
In various embodiments, used sputtering targets are refurbished at least in part by maintaining a large obliquity angle (300) between the spray-deposition gun (320) and the depressed surface contour (330) of the target during spray deposition of the target material.