公开(公告)号：EP2842246A4

公开(公告)日：2016-01-20

申请号：EP12875430

申请日：2012-04-26

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： PANOTOPOULOS GEORGIOS ,  TAN MICHAEL RENNE TY ,  SORIN WAYNE V ,  FATTAL DAVID A

IPC: H04B10/2581 ,  G02B6/293 ,  H04J14/02

CPC classification number: H04J14/02 ,  G02B6/29311 ,  G02B6/4214 ,  G02B6/4215 ,  G02B6/43 ,  H04B10/60

公开(公告)号：EP2745164A4

公开(公告)日：2015-05-20

申请号：EP11873381

申请日：2011-09-30

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： PANOTOPOULOS GEORGIOS ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  MATHAI SAGI VARGHESE ,  SORIN WAYNE V ,  PATRA SUSANT K

IPC: G02B27/10

CPC classification number: G02B6/2938 ,  G02B6/29367 ,  G02B6/4231 ,  G02B27/1006 ,  G02B27/106 ,  G02B27/1073 ,  G02B27/145

公开(公告)号：EP2753963A4

公开(公告)日：2015-02-25

申请号：EP11872062

申请日：2011-09-06

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： MATHAI SAGI VARGHESE ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  SORIN WAYNE V ,  PANOTOPOULOS GEORGIOS ,  PATRA SUSANT K

IPC: G02B6/42 ,  G02B3/00 ,  G02B6/43

CPC classification number: G02B6/4204 ,  G02B3/0075 ,  G02B6/4231 ,  G02B6/4232 ,  G02B6/4238 ,  G02B6/4239 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4257 ,  G02B6/43 ,  Y10T29/49778

公开(公告)号：EP2856228A4

公开(公告)日：2016-02-17

申请号：EP12877339

申请日：2012-05-24

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： PANOTOPOULOS GEORGIOS ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  SORIN WAYNE VICTOR ,  MATHAI SAGI VARGHESE ,  PATRA SUSANT K

IPC: G02B6/38

CPC classification number: G02B6/293 ,  G02B6/2817 ,  G02B6/29311 ,  G02B6/29367 ,  G02B6/3827 ,  G02B6/3845 ,  G02B6/3885

公开(公告)号：EP2810111A4

公开(公告)日：2015-09-23

申请号：EP12867223

申请日：2012-01-31

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： MATHAI SAGI VARGHESE ,  TAN MICHAEL RENNE TY ,  ROSENBERG PAUL KESSLER ,  SORIN WAYNE VICTOR ,  PANOTOPOULOS GEORGIOS ,  PATRA SUSANT K ,  STRAZNICKY JOSEPH

IPC: G02B6/42 ,  G02B6/12 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/167 ,  H04B10/25 ,  H05K1/02

CPC classification number: H04B10/2504 ,  G02B6/4245 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/167 ,  H05K1/0274 ,  H05K2201/0305 ,  H05K2201/10121 ,  H05K2201/10977

Abstract: A combination underfill-dam and electrical-interconnect structure for an opto-electronic engine. The structure includes a first plurality of electrical-interconnect solder bodies. The first plurality of electrical-interconnect solder bodies includes a plurality of electrical interconnects. The first plurality of electrical-interconnect solder bodies, is disposed to inhibit intrusion of underfill material into an optical pathway of an opto-electronic component for the opto-electronic engine. A system and an opto-electronic engine that include the combination underfill-dam and electrical interconnect structure are also provided.

公开(公告)号：EP2807509A4

公开(公告)日：2015-08-26

申请号：EP12866666

申请日：2012-01-27

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： MATHAI SAGI VARGHESE ,  TAN MICHAEL RENNE TY ,  SORIN WAYNE VICTOR ,  ROSENBERG PAUL KESSLER ,  PANOTOPOULOS GEORGIOS ,  PATRA SUSANT K

IPC: G02B6/12 ,  G02B6/42 ,  H01L31/0232

CPC classification number: G02B6/423 ,  G02B6/4204 ,  G02B6/4212 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4279 ,  G02B6/4292 ,  H01L31/02325

公开(公告)号：EP2737359A4

公开(公告)日：2015-05-06

申请号：EP11870354

申请日：2011-07-29

Applicant: HEWLETT PACKARD DEVELOPMENT CO

Inventor： SORIN WAYNE V ,  TAN MICHAEL RENNE TY ,  MATHAI SAGI VARGHESE ,  ROSENBERG PAUL KESSLER ,  PANOTOPOULOS GEORGIOS

IPC: G02B27/14 ,  G02B6/28 ,  G02B27/10

CPC classification number: G02B6/2817 ,  G02B27/1073 ,  G02B27/14 ,  G02B27/141 ,  G02B27/149