公开(公告)号：US20220344239A1

公开(公告)日：2022-10-27

申请号：US17240688

申请日：2021-04-26

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  Brady Dulian ,  Steven Dean

IPC: H01L23/373 ,  H05K1/02

Abstract: Examples described herein relate to a cooling assembly. In some examples, the cooling assembly includes a cooling component and a thermal gap pad disposed in thermal contact with the cooling component. The thermal gap pad includes thermally conductive fabric that is curved at a plurality of locations along one or both of its length or its breadth, wherein a first side of the thermal gap pad is disposed in thermal contact with the cooling component and a second side of the thermal gap pad is disposable in thermal contact with a heat generating component. Certain examples described herein also relate to an electronic circuit module having the cooling assembly.

公开(公告)号：US11579668B2

公开(公告)日：2023-02-14

申请号：US17030677

申请日：2020-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Steven Dean ,  John Franz ,  Brady Dulian

IPC: G06F1/18 ,  H05K1/14 ,  H05K7/10

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.

公开(公告)号：US20220091642A1

公开(公告)日：2022-03-24

申请号：US17030677

申请日：2020-09-24

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Steven Dean ,  John Franz ,  Brady Dulian

IPC: G06F1/18 ,  H05K1/14 ,  H05K7/10

Abstract: Example implementations relate to a host device and a method for thermal management of a removable device, such as a pluggable electronic transceiver comprising a plurality of spring fingers that provide multipoint contact conduction cooling of the removable device. The host device includes a host circuit board having a connector, and a thermal management unit having a cooling component and the plurality of spring fingers. The cooling component is coupled to a portion of the host circuit board and includes a partially protruded portion. Each of the plurality of spring fingers includes a first end coupled to the partially protruded portion, and a second end having a dry contact surface to establish a direct thermal interface with a peripheral surface of the removable device to allow waste-heat to transfer from the removable device to the cooling component through each spring finger.