Abstract:
A system and method for a computing device having a processor, a memory module including volatile memory for random access memory (RAM), and an integrated circuit to intercept an error signal from the processor, the intercept delaying a system shutdown of the computing device. Firmware is executed by the processor to copy contents of the volatile memory to a non-volatile memory during the delay of the system shutdown.
Abstract:
Example implementations relate to an in-line memory module carrier for an M.2 form factor. For example, an in-line memory module carrier can include a circuit board having an in-line memory module form factor to receive an M.2 form factor module, an edge interface on a longitudinal edge of the circuit board for transmission of power between the M.2 form factor module and a host connector, the edge interface having an electrical contact, and a power regulator to receive a first voltage from the host connector and convert the first voltage to a second voltage to power the M.2 form factor module.
Abstract:
Example implementations relate to backup power communication. For example, a system for backup power communication can include a shared backup power supply coupled to a node, a plurality of loads supported by the node, and a pass-through device to support multi-master communication between the shared backup power supply and the plurality of loads.
Abstract:
A computing device having firmware, an uninterruptible power supply (UPS), and a memory module with volatile memory. Firmware tasks are prioritized to elevate tasks associated with the copying of the contents of the volatile memory to the nonvolatile memory external to the memory module during the loss of main or primary power.
Abstract:
A method and system to configure a voltage-regulating device. The method may identify, via firmware, a component configuration, of a computing device. The method may determine, via firmware, a value to specify for a voltage-regulating parameter of voltage-regulating devices associated with the components. The determination of the value may be based on the component configuration. The method may further program, via firmware, the voltage-regulating devices with values to regulate a supply voltage supplied to the component configuration.
Abstract:
In one example, a processor may include a processor core with a central processing unit as well as a processor cache separate from the processor core. The processor may also include flushing circuitry. The flushing circuitry may identify a power loss event for the processor. In response, the flushing circuitry may selectively power the processor by providing power to the processor cache but not to the processor core. The flushing circuitry may further flush data content of the processor cache to a non-volatile memory separate from the processor.
Abstract:
A circuit includes a voltage level translator having a low side input/output (I/O) port and a high side I/O port. The voltage level translator converts a low side signal applied to the low side I/O port to a high side signal at the high side I/O port and converts a high side signal applied to the high side I/O port to a low side signal at the low side I/O port. A bias circuit provides a bias current to operate the voltage level translator. A current steering device divert transient current from the bias circuit during transitions of the low side signal applied to the low side I/O port or the high side signal applied to the high side I/O port.
Abstract:
Disclosed is a technique for determining whether a component is present in a computing device. An example method includes obtaining a signal quality parameter describing a signal quality characteristic of a data bus, comparing the signal quality parameter to a signal quality value corresponding with a known component presence state, and determining whether a component is present in the computing device based on the comparison.
Abstract:
A method related to removing layers in a multi-layered PCB is described. The method includes removing one of more layers of a multi-layered printed circuit board (PCB) layer via material removal techniques. The removal of the layers reduces the thickness of the multi-layered PCB in a section while the thickness in another section of the PCB is maintained. The method includes forming a recess in the section of the multi-layered PCB to provide additional spacing on the multi-layered PCB. The method further includes placing components in the recessed section of the multi-layered PCB.
Abstract:
Example implementations relate to backup power supply support. For example, a backup power supply support system can include a shared backup power supply controlled by a backup power control module and a support switch coupled to the shared backup power supply. The support switch enables a transition from a primary power supply to the shared backup power supply and the support switch includes system firmware. The system firmware detects a primary power supply compromise, isolates a hardware switch from the shared backup power supply, enables the hardware switch, and transitions to the shared backup power supply.