公开(公告)号：EP2433290A4

公开(公告)日：2017-08-02

申请号：EP09845024

申请日：2009-05-19

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： FARTASH ARJANG ,  MARDILOVICH PETER

IPC: H01G9/042 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1646

Abstract: A nanoflat resistor includes a first aluminum electrode (360), a second aluminum electrode (370); andnanoporous alumina (365) separating the first and second aluminum electrodes (360, 370). A substantially planar resistor layer (330) overlies the first and second aluminum electrodes (360, 370) and nanoporous alumina (365). Electrical current passes from the first aluminum electrode (360), through a portion of the planar resistor layer (350) overlying the nanoporous alumina (365) and into the second aluminum electrode (370). A method for constructing a nanoflat resistor (390) is also provided.

Abstract translation: 纳米薄膜电阻器包括第一铝电极（360），第二铝电极（370）; 和分离第一和第二铝电极（360,370）的纳米多孔氧化铝（365）。 基本上平面的电阻层（330）覆盖第一和第二铝电极（360,370）和纳米多孔氧化铝（365）。 电流从第一铝电极（360）通过覆盖纳米多孔氧化铝（365）并进入第二铝电极（370）的平面电阻器层（350）的一部分。 还提供了一种用于构造纳米平板电阻器（390）的方法。

公开(公告)号：EP2670600A4

公开(公告)日：2018-02-14

申请号：EP11857775

申请日：2011-01-31

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： MARDILOVICH PETER ,  WHITE LAWRENCE H ,  TORNIAINEN ERIK D

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/05 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2002/14387

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

公开(公告)号：EP2630276A4

公开(公告)日：2017-04-19

申请号：EP10858760

申请日：2010-10-21

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： MARDILOVICH PETER ,  WEI QINGQIAO ,  FULLER ANTHONY M

IPC: C25D11/04 ,  B82B3/00 ,  C25D11/26 ,  C25D11/34

CPC classification number: B81C1/00373 ,  B01L3/502707 ,  B01L2300/0896 ,  B81C1/00031 ,  B82Y40/00 ,  C25D1/006 ,  C25D11/02 ,  C25D11/045 ,  C25D11/12 ,  C25D11/18 ,  C25D11/26 ,  Y10S977/89 ,  Y10T428/24562

Abstract: Nano-structure includes a substrate and a non-oxidized portion of a metal layer (having an expansion coefficient, during oxidation, that is more than 1) on the substrate. An oxide layer is formed on the non-oxidized portion. A plurality of metal oxide nano-pillars is grown from the oxide layer. Each nano-pillar is grown through a plurality of pores defined in a template. A space is defined between adjacent nano-pillars. A continuous metal oxide cap layer is over the nano-pillars and over, but not in, the space between adjacent nano-pillars. The cap layer is formed from end portions of the nano-pillars that merge together over a template surface. The cap layer is in contact with all of the nano-pillars. The oxide layer, the nano-pillars, and the oxide cap layer are formed from anodization of portions of the metal layer.