公开(公告)号：EP2670600A4

公开(公告)日：2018-02-14

申请号：EP11857775

申请日：2011-01-31

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： MARDILOVICH PETER ,  WHITE LAWRENCE H ,  TORNIAINEN ERIK D

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/05 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2002/14387

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

公开(公告)号：EP3099497A4

公开(公告)日：2017-09-20

申请号：EP14880844

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： WHITE LAWRENCE H ,  FULLER ANTHONY M ,  PHAM HUYEN

IPC: B41J2/05 ,  B41J2/14 ,  B41J2/16

CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

Abstract translation: 本公开包括制造热喷墨打印头的方法，该方法包括：沉积具有厚度的第一金属层以形成电源总线;沉积第一电介质层;在第一电介质层中形成通孔，以将第一金属层连接到 沉积第二金属层;沉积电阻层;在电阻层中形成热电阻;沉积第二电介质层;以及去除第二电介质层的一部分。