公开(公告)号：EP2598334A4

公开(公告)日：2018-02-21

申请号：EP10855429

申请日：2010-07-28

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： GOVYADINOV ALEXANDER ,  TORNIAINEN ERIK D ,  MESSENGER ROBERT

IPC: B41J2/14 ,  B41J2/175

CPC classification number: B41J2/17596 ,  B41J2/1404 ,  B41J2/14145 ,  B41J2/1753 ,  B41J2002/14387 ,  B41J2002/14467

公开(公告)号：EP2590820A4

公开(公告)日：2018-02-14

申请号：EP10854840

申请日：2010-10-28

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： GOVYADINOV ALEXANDER ,  KORNILOVICH PAVEL ,  TORNIAINEN ERIK D ,  MARKEL DAVID P

IPC: B41J2/175 ,  B41J2/045 ,  B41J2/14

CPC classification number: B41J2/1404 ,  B41J2002/14467 ,  B41J2202/12

Abstract: A fluid ejection assembly includes a fluid slot, a plurality of drop generators, and a fluid circulation pump to circulate fluid from the fluid slot through each drop generator individually and back into the fluid slot.

公开(公告)号：EP2670600A4

公开(公告)日：2018-02-14

申请号：EP11857775

申请日：2011-01-31

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： MARDILOVICH PETER ,  WHITE LAWRENCE H ,  TORNIAINEN ERIK D

IPC: B41J2/14 ,  B41J2/16

CPC classification number: B41J2/05 ,  B41J2/1412 ,  B41J2/14129 ,  B41J2/1603 ,  B41J2/1626 ,  B41J2002/14387

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

公开(公告)号：EP3180415A4

公开(公告)日：2018-02-28

申请号：EP14899863

申请日：2014-08-15

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： GOVYADINOV ALEXANDER ,  TORNIAINEN ERIK D ,  MARKEL DAVID P ,  KORNILOVICH PAVEL

IPC: C12M1/00 ,  B01L3/00 ,  B81B1/00 ,  F04B53/10 ,  F04F7/00 ,  F16K99/00

CPC classification number: F16K99/0021 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/023 ,  B01L2300/0864 ,  B01L2400/0442 ,  B01L2400/0622 ,  F04B53/10 ,  F04F7/00 ,  F16K99/0042 ,  F16K99/0055 ,  F16K2099/0084

Abstract: In an example implementation, a method of controlling a microfluidic valve includes activating a first inertial pump at a first frequency, and a second inertial pump at a second frequency to create a first fluid flow pattern within a microfluidic valve. The method also includes adjusting at least one of the first frequency and the second frequency to change the first fluid flow pattern to a second fluid flow pattern.

公开(公告)号：EP3099964A4

公开(公告)日：2017-08-30

申请号：EP14880834

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEV COMPANY L P

Inventor： GOVYADINOV ALEXANDER ,  TORNIAINEN ERIK D ,  KORNILOVICH PAVEL ,  MARKEL DAVID P

IPC: F16K13/10 ,  F04B43/04

CPC classification number: F16K99/0019 ,  F04B19/006 ,  F04B19/24 ,  F04B49/06 ,  F16K99/0055

Abstract: A microfluidic valve comprises a first reservoir, a second reservoir, an inertial pump and a channel connecting the first reservoir to the second reservoir. The second reservoir is to receive fluid from the first reservoir through the channel under a pressure gradient. The inertial pump is within the channel proximate the second reservoir and distant the first reservoir.

Abstract translation: 微流体阀包括第一贮存器，第二贮存器，惯性泵和将第一贮存器连接到第二贮存器的通道。 第二储存器在压力梯度下通过通道从第一储存器接收流体。 惯性泵位于靠近第二储存器并远离第一储存器的通道内。