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公开(公告)号:US3672047A
公开(公告)日:1972-06-27
申请号:US3672047D
申请日:1970-12-29
Applicant: HITACHI LTD
Inventor: SAKAMOTO YUZABURO , TOYOOKA MORIO
CPC classification number: H01L24/85 , B23K20/005 , B23K20/007 , B23K2201/38 , B23K2201/40 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/78 , H01L2224/04042 , H01L2224/05624 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/48463 , H01L2224/4847 , H01L2224/48601 , H01L2224/48624 , H01L2224/78301 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85365 , H01L2224/85401 , H01L2224/85801 , H01L2224/85815 , H01L2224/8592 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01027 , H01L2924/01028 , H01L2924/01039 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/2076 , Y10T29/49169 , H01L2924/00014 , H01L2924/00 , H01L2924/00015
Abstract: A connector wire is bonded to a solder electrode by pressing the end portion thereof to the solder electrode by using a capillary while the capillary is heated up to a temperature not less than the melting point of the solder, by melting the solder electrode and then by cooling the whole bonding area of the connector wire and the solder electrode, thereby the end portion of the connector wire is buried in the solder electrode and is firmly fixed thereto.
Abstract translation: 通过使用毛细管将连接器线焊接到焊料电极上,同时将毛细管加热至不低于焊料的熔点的温度,通过熔化焊料电极,然后通过 冷却连接器线和焊料电极的整个接合区域,从而将连接器线的端部埋入焊料电极中并牢固地固定在其上。
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公开(公告)号:DE2332230A1
公开(公告)日:1975-01-09
申请号:DE2332230
申请日:1973-06-25
Applicant: HITACHI LTD
Inventor: TOYOOKA MORIO , SAKAMOTO YUZABURO , YAMAMOTO SHUNICHI
Abstract: A wiring device for micro-miniature circuits has a capillary tube for attaching one end of a wire to a surface and with a clamp on an arm moving up and down independently of the capillary and limited by a stop located between them; the clamp grips the wire as the capillary moves upwards and a burner fuses a globule at the end of the wire, the burner being held on the clamp arm at a distance below the arm equal to that between the arm stop and the plane in which the attachment is to be made by the globule.
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公开(公告)号:JPS61287250A
公开(公告)日:1986-12-17
申请号:JP12815485
申请日:1985-06-14
Applicant: HITACHI LTD
Inventor: OZAWA MASAKAZU , TOYOOKA MORIO
IPC: H01L23/50 , H01L21/304 , H01L23/48
Abstract: PURPOSE:To stably clean by providing a loader and an unloader in a mechanism for conveying a unit to be cleaned along the circumferential route dipped partly in a cleanser to prevent the surface of the cleanser from varying. CONSTITUTION:A unit 10 to be cleaned is bridged over a saddle 8 on a belt 6 of a conveyor 7 from a chute 9, merged in cleaning water 2 in an inverted attitude by a guide 11, and cleaned by a supersonic vibrator 3 on the bottom of a tank 1. The cleaned unit 10 is removed through a chute 12. According to this construction, the surface level of the water 2 does not vary when the unit 10 is telescoped into or out of the water 2 so that the height of the surface level cleaned in the highest efficiency does not change. Thus, it can be stably and effectively cleaned. Since the unit 10 is not telescoped through a cutout 13, an unstable transmission of the supersonic vibration due to supply of excessive water 2 does not occur.
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公开(公告)号:JPS6133425A
公开(公告)日:1986-02-17
申请号:JP14949184
申请日:1984-07-20
Applicant: Hitachi Ltd
Inventor: TOYOOKA MORIO , OZAWA MASAKAZU
CPC classification number: B65G57/03
Abstract: PURPOSE:To decrease a margin necessary for releasing a long length material from its hold condition, by providing such an arrangement that one of holding members are moved outward to release one side of the long length material from its holding condition and then the other holding member is moved inward to release the remaining side of the material. CONSTITUTION:After movable beds 10, 20 on both sides are moved to predetermined positions along a conveyor, cylinder devices 11, 21 on both sides are raised to engage the pawl parts 14, 20 of holding members 13, 23 with the lower edges of both right and left ends of a magazine 1. After the movable beds 10, 20 are moved to the position of a container 3, the cylinder devices 11, 21 are lowered to set the magazine 1 down into the container 3. Further, a cylinder device 27 is extended outward to rotate the holding member 23 about a pin 26 so that the pawl part 24 is released from the lower edge of the magazine 1. Thereafter, the cylinder device 17 is retracted to rotate a stopper 15 about a pin 16, and therefore, the magazine 1 is moved to the right to be released from the pawl part 14.
Abstract translation: 目的:为了减少从保持状态释放长长度材料所需的余量,通过提供一种将保持构件中的一个向外移动以将长长材料的一侧从其保持状态释放的布置,然后另一个保持构件 向内移动以释放材料的剩余侧。 构成:在两侧的移动床10,20移动到沿着输送机的预定位置之后,两侧的气缸装置11,21升高以与保持构件13,23的棘爪部分14,20接合,同时两者的下边缘 在活动床10,20移动到容器3的位置之后,气缸装置11,21下降,将料仓1向下放入容器3中。此外,气缸装置 27向外延伸以使保持构件23围绕销26旋转,使得棘爪部分24从盒1的下边缘释放。之后,缸装置17缩回以围绕销16旋转止动件15,并且 因此,盒1向右移动以从棘爪部14释放。
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公开(公告)号:JPS6122688A
公开(公告)日:1986-01-31
申请号:JP14234084
申请日:1984-07-11
Applicant: Hitachi Ltd
Inventor: TOYOOKA MORIO
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公开(公告)号:JPS5923598A
公开(公告)日:1984-02-07
申请号:JP13198682
申请日:1982-07-30
Applicant: Hitachi Ltd , Hitachi Electr Eng
Inventor: TOSHIMA MASATO , TOYOOKA MORIO , SHIMIZU TAKESHI
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公开(公告)号:JPS5851971A
公开(公告)日:1983-03-26
申请号:JP14790481
申请日:1981-09-21
Applicant: HITACHI LTD
Inventor: OOTSUKA KENICHI , TOYOOKA MORIO , SHIMIZU TAKESHI
IPC: C02F1/00
Abstract: PURPOSE:To enhance a washing effect while saving washing water, by combining two or more washing vessels for removing flux from a semiconductor product after being soldered, and replenishing the overflow part of fresh water supplied to one vessel through a reservoir to the other washing vessel. CONSTITUTION:Tap water or pure water as fresh water is supplied to a second washing vessel 2 from a water-supply pipe 6 through a flow meter 7 under the condition that a first washing vessel 1, the second washing vessel 2 and a reservoir 3 are filled with washing water, while workpieces to be washed are supplied along the arrow A and successively washed. On the other hand, the washing water to the first washing vessel 1 is circulated from the reservoir 3 through water-supply pipes 10, 11 and a shower 12 to the first washing vessel 1 by a pump 9. The washing water in the reservoir 3 is supplied through water- supply pipes 13, 14 and a shower 15 to a discharging vessel 4 by the pump 9, too.
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公开(公告)号:JPH11330107A
公开(公告)日:1999-11-30
申请号:JP15355898
申请日:1998-05-18
Applicant: HITACHI LTD , HITACHI TOKYO ELECTRONICS
Inventor: TOYOOKA MORIO , SUZUKI JUNICHI , ISHIOKA MASATO
IPC: H01L21/304 , H01L21/50 , H01L21/60
Abstract: PROBLEM TO BE SOLVED: To improve the efficiency of cleaning work for a TCP.IC carrier. SOLUTION: A supply reel 27 for a carrier 1 is arranged on the outside of a detergenet cleaning tank 21, a take-up reel 28 for the cleaned carrier 1 is arranged on the outside of a water cleaning tank 25, and drive rollers 29 are arranged around respective reels 27, 28 and respective tanks 21, 25. Guide rollers 30 are arranged in the tanks 21, 25 and supported by a lifting driver 31 so as to be arbitrarily rotatable. The driver 31 is controlled so that the moving speed of the carrier 1 following the lift of the rollers 30 corresponds to the passing speed of the carrier 1 through the tanks 21, 25. Since the guide rollers 30 are arranged on the upper parts of the tanks 21, 25 and the carrier 1 is wound around the drive rollers 29 and the guide rollers 30, the new/old substitution work time of the supply reel 27 fan be shortened. Since the carrier 1 is cleaned also at the lifting of the guide rollers 30, working time can be shortened.
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公开(公告)号:JPS6331275B2
公开(公告)日:1988-06-23
申请号:JP15061181
申请日:1981-09-25
Applicant: HITACHI LTD
Inventor: TOYOOKA MORIO
IPC: B08B3/12 , B05B3/14 , B08B3/02 , B08B3/08 , H01L21/304
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公开(公告)号:JPS58142557A
公开(公告)日:1983-08-24
申请号:JP2439482
申请日:1982-02-19
Applicant: HITACHI LTD
Inventor: OZAWA MASAKAZU , SUGIMOTO TATSUO , SHIMIZU TAKESHI , TOYOOKA MORIO , TABATA KATSUHIRO , SUZUKI SHIGERU , KOMARU TAKESHI
Abstract: PURPOSE:To simplify the connection work and contrive the improvement of the reliability by a method wherein the lead width of the upper side semiconductor device is formed narrower than the lead width of the lower side devide, and they are superposed resulting in elastic junction. CONSTITUTION:Leads 5b and 6b of the upper and lower semiconductor devices are extended downward at equal angles theta5 and theta6. When the devices 3 and 4 are superposed each other, they are well contacted by the angles theta5 and theta6 and the thickness of the leads 5b and 6b, and simply soldered. Since the both leads are extended in the same direction, the damage of connection due to a spring-back force is not generated after soldering. At the time of soldering, an ultrasonic vibration 13 is applied on the surface of a bath 12 with the fused solder 11, then the connection part of the leads 5b and 6b are dipped into the solder 11, and thus the soldering is performed.
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