Light sensitive copolymers, a process for their manufacture and copying compositions containing them
    1.
    发明授权
    Light sensitive copolymers, a process for their manufacture and copying compositions containing them 失效
    光敏共聚物,其制造方法和复制含有它们的组合物

    公开(公告)号:US3905820A

    公开(公告)日:1975-09-16

    申请号:US46774074

    申请日:1974-05-07

    Applicant: HOECHST AG

    Inventor: FRASS WERNER

    Abstract: This invention relates to a light-sensitive copying composition which contains from 65 to 99 per cent by weight of at least one copolymer containing from 10 to 55 mole per cent of N-allylmaleimide units, from 0 to 15 mole per cent of maleic acid units and from 45 to 80 mole per cent of units of the formula -CH2-CHZ, wherein X is selected from the group consisting of a hydrogen atom, a halogen atom, an alkyl or alkoxy group containing from 1 to 3 carbon atoms, an aryl group or an acyloxy group, and Z is selected from the group consisting of a hydrogen atom, a halogen atom or an alkyl group containing 1 to 2 carbon atoms, from 0 to 35 per cent by weight of at least one photopolymerizable compound having at least two vinyl or vinylidene groups in the molecule and which boils above 100*C under standard pressure, and from 1 to 8 per cent by weight of at least one photoinitiator.

    Abstract translation: 本发明涉及一种光敏复印组合物,其含有65至99重量%的至少一种共聚物,其含有10至55摩尔%的N-烯丙基 - 马来酰亚胺单元,0至15摩尔%的马来酸 酸单元和45至80摩尔%的式-CH 2 -CHZ-的单元,其中X选自氢原子,卤素原子,含有1至3个碳原子的烷基或烷氧基 ,芳基或酰氧基,Z选自氢原子,卤素原子或含有1至2个碳原子的烷基,0至35重量%的至少一种可光聚合化合物 在分子中具有至少两个乙烯基或亚乙烯基,并且在标准压力下沸点高于100℃,和至少一种光引发剂的1至8重量%。

    2.
    发明专利
    未知

    公开(公告)号:DE59406576D1

    公开(公告)日:1998-09-03

    申请号:DE59406576

    申请日:1994-12-19

    Applicant: HOECHST AG

    Abstract: PCT No. PCT/EP94/04218 Sec. 371 Date Sep. 20, 1996 Sec. 102(e) Date Sep. 20, 1996 PCT Filed Dec. 19, 1994 PCT Pub. No. WO95/18019 PCT Pub. Date Jul. 6, 1995This invention relates to a process for preparing printing plates which are used in offset printing. The process produces a plate which comprises a substrate film in which a thin durable hydrophilic layer has been applied thereto. In the process, the substrate film is first microroughened by pressure blasting so that the surface roughness, RA, is in the range 0.3 to 1.5 mu m. Subsequently, a durable, firmly adhering hydrophilic layer is applied to substrate by plasma-spraying an oxide powder with a particle size of 1 to 40 mu m onto the substrate. This process produces a plate whose surface is not greasy or grainy.

    3.
    发明专利
    未知

    公开(公告)号:BR9003633A

    公开(公告)日:1991-08-27

    申请号:BR9003633

    申请日:1990-07-26

    Applicant: HOECHST AG

    Abstract: A description is given of a solvent mixture for photocurable mixtures which consist of a) a mixture of aa) a polar solvent of the formula R - OH, where R is H or alkyl, or aa') a monoalkyl ether or an alkyl ether ester of a glycol, and ab) an organic solvent having a boiling point in the 60 - 160 DEG C range which is an aliphatic ketone, an alkanoic acid or an alkyl ester of hydroxyalkanoic acid or a cyclic ether, in a quantity ratio such that a homogeneous mixture is formed, and b) 0.1 to 8% by weight (based on the total solvent mixture) of a solvent whose boiling point is higher than any individual boiling point of the solvents mentioned under (a). The coating solutions produce layers whose light sensitivity is higher than that of similar layers obtained without adding (b).

    PRODUCING RELIEF COPIES
    10.
    发明专利

    公开(公告)号:AU8320482A

    公开(公告)日:1982-11-18

    申请号:AU8320482

    申请日:1982-05-03

    Applicant: HOECHST AG

    Abstract: A process for producing relief copies wherein the light-hardenable layer of a light-hardenable copying material, which contains a photopolymerizable mixture, a photodimerizable polymeric compound or a diazonium salt polycondensation product, is exposed to a light image, the exposed layer is subjected to a brief ultrasonic treatment, and the unexposed areas of the layer are thereafter washed away by means of a developer. As a result of the ultrasonic treatment, shorter exposure times may be used and better in-depth hardening of the layer may be achieved.

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