Abstract:
The invention relates to the use of a mixture of film forming water-insoluble and alkali-soluble novolak resin and thermally stable, alkali-soluble and water-insoluble polyalkylated resin in photosensitive compositions where the polyalkylated resin is a reaction product of a carboxylic acid and at least one substituted phenyl carbinol. The present invention also relates to a method for producing a semiconductor device by coating, imaging and developing the photosensitive composition containing a mixture of novolak resin and the polyalkylated resin of this invention.
Abstract:
The present invention provides a method for producing a water insoluble, aqueous alkali soluble novolak resins having consistent molecular weight and superior performance in photoresist composition, by isolating such novolak resin without high temperature distillation. A method is also provided for producing photoresist composition from such a novolak resin and for producing semiconductor devices using such a photoresist composition.
Abstract:
A photosensitizer comprising a trishydroxyphenylethane 80/20 to 50/50 2,1,5-/2,1,4-diazonaphthoquinone sulfonate, and a trishydroxybenzophenone 0/100 to 20/80 2,1,5-/2,1,4-diazonaphthoquinone sulfate, and a photoresist composition containing such photosensitizer, the photosensitizer being present in the photoresist composition in an amount sufficient to uniformly photosensitize the photoresist composition; and a water insoluble, aqueous alkali soluble novolak resin, the novolak resin being present in the photoresist composition in an amount sufficient to form a substantially uniform photoresist composition.
Abstract:
A flash post exposure bake (Flash PEB) process for a diazonaphthoquinone sulfonate ester-novolak positive photoresist is described which offers significant advantages. This process uses a higher than conventional post exposure baking (PEB) temperature (>/=130 DEG C) and a very short baking time (
Abstract:
The present invention provides a photoresist composition containing a photosensitive component, a mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0, and a suitable solvent and a method for producing such a photoresist. The present invention also provides semiconductor devices produced using such a photoresist composition and a method for producing such semiconductor devices.
Abstract:
A flash softbake process for a diazonaphthoquinone sulfonate ester-novolak positive photoresist is described which offers significant advantages. This process uses a higher than conventional soft-baking (SB) temperature (>/=130 DEG C) and a very short baking time (
Abstract:
A novolak/polyhydroxystyrene copolymer having a structure as shwon in formula (I), in which R = H, -CH3, -CH2CH3 or -CH2CH2CH3, n = 2 to 15, a process for producing such a copolymer, a photoresist composition containing such a copolymer, a process for producing such a photoresist and a process for producing a semiconductor device using such a photoresist.
Abstract:
The present invention provides methods for producing water insoluble, aqueous alkali soluble novolak resins having a very low level of metal ions and a substantially consistent molecular weight. A method is also provided for producing photoresist composition from such novolak resins and for producing semiconductor devices using such photoresist compositions.
Abstract:
The invention relates to the use of thermally stable, water-insoluble and alkali-soluble polyalkylated phenolic resins in photosensitive compositions, where the polyalkylated resin is a reaction product of a carboxylic acid and at least one substituted phenyl carbinol. The invention also relates to the use of these photosensitive compositions in manufacturing semiconductor devices.
Abstract:
The present invention provides mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50 % and having dissolution rates which differ by a factor of at least 2.0. A method is also provided for producing such novolak resin mixtures.