公开(公告)号：JP2002198540A

公开(公告)日：2002-07-12

申请号：JP2001319918

申请日：2001-10-17

Applicant: HONEYWELL INC

Inventor： HOCKER BENJAMIN G ,  BURNS DAVID W ,  IKINWANDE AKINTUNDE I ,  HORNING ROBERT D ,  MIRZA AMIR R ,  STRATTON THOMAS G ,  SAATHOFF DIEDRICH J ,  CARNEY JAMES K ,  MCPHERSON SCOTT A

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To manufacturing a capacitive sensor device where three wafers are jointed to a pressure pipe. SOLUTION: A first wafer has a metallized layer on the upper surface for forming the upper surface of a diaphragm layer. There is another thermal oxide layer below the diaphragm layer welded to the wafer. There is another metallized layer between the wafer and pressure pipe. On this configuration, a pressure port is provided off the center. Additionally, at least three electric contacts are provided to related layers.

公开(公告)号：JP2002185014A

公开(公告)日：2002-06-28

申请号：JP2001319914

申请日：2001-10-17

Applicant: HONEYWELL INC

Inventor： HOCKER BENJAMIN G ,  BURNS DAVID W ,  IKINWANDE AKINTUNDE I ,  HORNING ROBERT D ,  MIRZA AMIR R ,  STRATTON THOMAS G ,  SAATHOFF DIEDRICH J ,  CARNEY JAMES K ,  MCPHERSON SCOTT A

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To manufacture a sensor, without damaging diaphragms. SOLUTION: A cavity is formed on a surface of a first semiconductor wafer and is almost filled with a material which can be removed without damaging the wafer. Another semiconductor wafer is bonded on the surface of the first semiconductor wafer, an access path to the cavity is formed on the first semiconductor wafer, and the filler is removed from the access path.

公开(公告)号：JP2001223368A

公开(公告)日：2001-08-17

申请号：JP2000376904

申请日：2000-12-12

Applicant: HONEYWELL INC

Inventor： HOCKER BENJAMIN G ,  BURNS DAVID W ,  IKINWANDE AKINTUNDE I ,  HORNING ROBERT D ,  MIRZA AMIR R ,  STRATTON THOMAS G ,  SAATHOFF DIEDRICH J ,  CARNEY JAMES K ,  MCPHERSON SCOTT A

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To improve surface treatment and junction of a wafer. SOLUTION: At least one wafer is immersed in a buffer oxide etchant, and the etchant is rinsed, and the same wafer is immersed in a solution of a hydroxide and H2O2, and the solution is rinsed, and the wafer is brought into contact. Also, a bird's beak upheaval part is removed by an etching processing.

公开(公告)号：CA2230979A1

公开(公告)日：1997-07-10

申请号：CA2230979

申请日：1996-12-13

Applicant: HONEYWELL INC

Inventor： RHODES MICHAEL L ,  STRATTON THOMAS G ,  KRAFTHEFER BRIAN C

IPC: G01J5/10 ,  G01J5/14 ,  G01J5/20 ,  G08B13/19 ,  G01J1/42 ,  G08B13/18

Abstract: An occupancy sensor (50) having a primary infrared radiation sensor (12) and a secondary infrared radiation sensor (14) in an integrated vacuum package having a window (52) that provides separate fields of view to the sensors, respectively. The primary sensor is for monitoring occupancy of a selected space. The secondary sensor is for monitoring the background radiation of the space. Signals from the primary and secondary sensors are electronically processed and compared, and the occupancy level of the selected space is determined. Temperature and visible light sensors may also be incorporated. Sensor information is used to control temperature, ventilation, lighting and other parameters of the selected space.

公开(公告)号：CA2179052A1

公开(公告)日：1995-06-22

申请号：CA2179052

申请日：1994-12-12

Applicant: HONEYWELL INC

Inventor： HIGASHI ROBERT E ,  RIDLEY JEFFREY A ,  STRATTON THOMAS G ,  WOOD R ANDREW

IPC: G01J1/02 ,  G01J5/10 ,  H01L27/14 ,  H01L27/146 ,  H01L27/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/10 ,  H01L23/18 ,  H01L23/26

Abstract: An efficient method brings together two wafers of dies that contain infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low ther mal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably b y solder, although ultrasound bonding can be used.

公开(公告)号：CA2230979C

公开(公告)日：2003-08-19

申请号：CA2230979

申请日：1996-12-13

Applicant: HONEYWELL INC

Inventor： RHODES MICHAEL L ,  STRATTON THOMAS G ,  KRAFTHEFER BRIAN C

IPC: G01J5/10 ,  G01J5/14 ,  G01J5/20 ,  G08B13/19 ,  G01J1/42 ,  G08B13/18

Abstract: An occupancy sensor (50) having a primary infrared radiation sensor (12) and a secondary infrared radiation sensor (14) in an integrated vacuum package having a window (52) that provides separate fields of view to the sensors, respectively. The primary sensor is fox monitoring occupancy of a selected space. The secondary sensor is for monitoring the background radiation of the space. Signals from the primary and secondary sensors are electronically processed and compared, and the occupancy level of the selected space is determined. Temperature and visible light sensors may also be incorporated. Sensor information is used to control temperature, ventilation, lighting and other parameters of the selected space.

公开(公告)号：CA2179052C

公开(公告)日：2001-02-13

申请号：CA2179052

申请日：1994-12-12

Applicant: HONEYWELL INC

Inventor： HIGASHI ROBERT E ,  RIDLEY JEFFREY A ,  STRATTON THOMAS G ,  WOOD R ANDREW

IPC: G01J1/02 ,  G01J5/10 ,  H01L27/14 ,  H01L27/146 ,  H01L27/16 ,  H01L31/02 ,  H01L31/0203 ,  H01L23/10 ,  H01L23/18 ,  H01L23/26

Abstract: An efficient method brings together two wafers of dies that contain infrared transparent window or top cap with either an infrared detector or emitter array to produce a low cost infrared package. A low thermal conductivity gas or a vacuum may be used between the wafers for enhanced thermal isolation. Joining of the wafers is preferably by solder, although ultrasound bonding can be used.

公开(公告)号：DE69222448T2

公开(公告)日：1998-02-26

申请号：DE69222448

申请日：1992-02-06

Applicant: HONEYWELL INC

Inventor： HOCKER BENJAMIN G ,  IKINWANDE AKINTUNDE I ,  BURNS DAVID W ,  HORNING ROBERT D ,  MIRZA AMIR R ,  SAATHOFF DIEDRICH J ,  STRATTON THOMAS G ,  CARNEY JAMES K

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84 ,  G01L9/02 ,  G01L9/06 ,  G01D5/00

Abstract: A diaphragm transducer 201 is manufactured by forming cavities in a diaphragm layer which are backfilled with a material readily removed by etching. The diaphragm layer is bonded to a silicon wafer. Access passages are provided to enable removal of the backfill material.The transducer 201 is incorporated in a three-wafer capacitive sensor 4 bonded to a pressure tube 5 with pressure ports 204 and 205 leading to access pressure ports 206.

公开(公告)号：DE69222448D1

公开(公告)日：1997-11-06

申请号：DE69222448

申请日：1992-02-06

Applicant: HONEYWELL INC

Inventor： HOCKER BENJAMIN G ,  IKINWANDE AKINTUNDE I ,  BURNS DAVID W ,  HORNING ROBERT D ,  MIRZA AMIR R ,  SAATHOFF DIEDRICH J ,  STRATTON THOMAS G ,  CARNEY JAMES K

IPC: G01L9/04 ,  B81C1/00 ,  G01L9/00 ,  G01L9/12 ,  H01L21/02 ,  H01L21/20 ,  H01L21/306 ,  H01L29/84 ,  G01L9/02 ,  G01L9/06 ,  G01D5/00

Abstract: A diaphragm transducer 201 is manufactured by forming cavities in a diaphragm layer which are backfilled with a material readily removed by etching. The diaphragm layer is bonded to a silicon wafer. Access passages are provided to enable removal of the backfill material.The transducer 201 is incorporated in a three-wafer capacitive sensor 4 bonded to a pressure tube 5 with pressure ports 204 and 205 leading to access pressure ports 206.