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公开(公告)号:JP2001223368A
公开(公告)日:2001-08-17
申请号:JP2000376904
申请日:2000-12-12
Applicant: HONEYWELL INC
Inventor: HOCKER BENJAMIN G , BURNS DAVID W , IKINWANDE AKINTUNDE I , HORNING ROBERT D , MIRZA AMIR R , STRATTON THOMAS G , SAATHOFF DIEDRICH J , CARNEY JAMES K , MCPHERSON SCOTT A
Abstract: PROBLEM TO BE SOLVED: To improve surface treatment and junction of a wafer. SOLUTION: At least one wafer is immersed in a buffer oxide etchant, and the etchant is rinsed, and the same wafer is immersed in a solution of a hydroxide and H2O2, and the solution is rinsed, and the wafer is brought into contact. Also, a bird's beak upheaval part is removed by an etching processing.
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公开(公告)号:JP2002198540A
公开(公告)日:2002-07-12
申请号:JP2001319918
申请日:2001-10-17
Applicant: HONEYWELL INC
Inventor: HOCKER BENJAMIN G , BURNS DAVID W , IKINWANDE AKINTUNDE I , HORNING ROBERT D , MIRZA AMIR R , STRATTON THOMAS G , SAATHOFF DIEDRICH J , CARNEY JAMES K , MCPHERSON SCOTT A
Abstract: PROBLEM TO BE SOLVED: To manufacturing a capacitive sensor device where three wafers are jointed to a pressure pipe. SOLUTION: A first wafer has a metallized layer on the upper surface for forming the upper surface of a diaphragm layer. There is another thermal oxide layer below the diaphragm layer welded to the wafer. There is another metallized layer between the wafer and pressure pipe. On this configuration, a pressure port is provided off the center. Additionally, at least three electric contacts are provided to related layers.
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公开(公告)号:JP2002185014A
公开(公告)日:2002-06-28
申请号:JP2001319914
申请日:2001-10-17
Applicant: HONEYWELL INC
Inventor: HOCKER BENJAMIN G , BURNS DAVID W , IKINWANDE AKINTUNDE I , HORNING ROBERT D , MIRZA AMIR R , STRATTON THOMAS G , SAATHOFF DIEDRICH J , CARNEY JAMES K , MCPHERSON SCOTT A
Abstract: PROBLEM TO BE SOLVED: To manufacture a sensor, without damaging diaphragms. SOLUTION: A cavity is formed on a surface of a first semiconductor wafer and is almost filled with a material which can be removed without damaging the wafer. Another semiconductor wafer is bonded on the surface of the first semiconductor wafer, an access path to the cavity is formed on the first semiconductor wafer, and the filler is removed from the access path.
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公开(公告)号:CA2357049C
公开(公告)日:2007-09-18
申请号:CA2357049
申请日:1999-11-23
Applicant: HONEYWELL INC
Inventor: HERB WILLIAM R , HORNING ROBERT D , CABUZ CLEOPATRA
Abstract: A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other. At least one of every pair of the sheets may be preformed into corrugations or into flaps to provide a predetermined mechanical bias between the pairs, or the sheets may form curved portions by an applied load to provide a displacement between the pairs. The sheets are preferably from about 1 .mu.m to about 100 .mu.m thick and the cells preferably have an individual displacement of from about .mu.m to about 200 .mu.m.
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公开(公告)号:AU2283801A
公开(公告)日:2001-07-16
申请号:AU2283801
申请日:2000-12-21
Applicant: HONEYWELL INC
Inventor: HORNING ROBERT D
IPC: H02N1/00
Abstract: A microactuator array with an integrally formed package is disclosed. Because the package is made from the same material and at the same time as the actuator itself, no extra time or cost is associated with packaging. In addition, it is contemplated that the package may be configured to provide all the necessary interconnections and leads for addressing and distributing power to the various layers in the microactuator stack. Thus, no additional steps or cost are associated with electrical interconnection.
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公开(公告)号:CA2205875A1
公开(公告)日:1996-07-11
申请号:CA2205875
申请日:1995-12-20
Applicant: HONEYWELL INC
Inventor: FRITZ BERNARD S , COLE BARRETT E , HORNING ROBERT D
Abstract: A monolithically constructed infrared, tunable Fabry-Perot cavity filterdetector for spectroscopic detection of particular substances having an absorption line in the wavelength range from 2 to 12 microns. The filterdetector has a hermetically sealed Fabry-Perot cavity that has a mirror which has an adjustable distance relative to another mirror of the cavity. The former mirror is adjusted by piezoelectric film on the mirror support or with piezoelectric stacks or wall supporting the mirror. There may be electrodes situated near the mirrors for capacitive sensing of the distance between the mirrors. Light to be filtered and detected comes in through a window wafer which may have diffractive or refractive microlenses, plus an optional spatial filter. After passing through the window wafer, the light is filtered by the tunable mirrors of the Fabry-Perot cavity. The portion of the light that is passed by the cavity is detected by an infrared microbolometer or a CCD array. The cavity and detector are hermetically sealed in a vacuum.
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公开(公告)号:AT290265T
公开(公告)日:2005-03-15
申请号:AT99957588
申请日:1999-11-23
Applicant: HONEYWELL INC
Inventor: CABUZ CLEOPATRA , HORNING ROBERT D , HERB WILLIAM R
Abstract: A microactuator array device, which includes a plurality of generally parallel thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrodes associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid during generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other. At least one of every pair of the sheets may be preformed into corrugations or into flaps to provide a predetermined mechanical bias between the pairs, or the sheets may form curved portions by an applied load to provide a displacement between the pairs. The sheets are preferably from about 1 mum to about 100 mum thick and the cells preferably have an individual displacement of from about 5 mum to about 200 mum.
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公开(公告)号:DE69222448T2
公开(公告)日:1998-02-26
申请号:DE69222448
申请日:1992-02-06
Applicant: HONEYWELL INC
Inventor: HOCKER BENJAMIN G , IKINWANDE AKINTUNDE I , BURNS DAVID W , HORNING ROBERT D , MIRZA AMIR R , SAATHOFF DIEDRICH J , STRATTON THOMAS G , CARNEY JAMES K
IPC: G01L9/04 , B81C1/00 , G01L9/00 , G01L9/12 , H01L21/02 , H01L21/20 , H01L21/306 , H01L29/84 , G01L9/02 , G01L9/06 , G01D5/00
Abstract: A diaphragm transducer 201 is manufactured by forming cavities in a diaphragm layer which are backfilled with a material readily removed by etching. The diaphragm layer is bonded to a silicon wafer. Access passages are provided to enable removal of the backfill material.The transducer 201 is incorporated in a three-wafer capacitive sensor 4 bonded to a pressure tube 5 with pressure ports 204 and 205 leading to access pressure ports 206.
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公开(公告)号:CA2357049A1
公开(公告)日:2000-07-06
申请号:CA2357049
申请日:1999-11-23
Applicant: HONEYWELL INC
Inventor: HORNING ROBERT D , CABUZ CLEOPATRA , HERB WILLIAM R
Abstract: A microactuator array device, which includes a plurality of generally parall el thin flexible polymer sheets bonded together in a predetermined pattern to form an array of unit cells on at least one layer. Thin conductive and dielectric films are deposited on the sheets to form a plurality of electrod es associated with the array of unit cells. A source of electric potential operably connects the electrodes, whereby electrostatic forces are generated most intensely proximate the point where the gap between the sheets is smallest. Inlets and outlets for each cell permit displacement of fluid duri ng generation of the electrostatic forces. In a preferred embodiment, the plurality of sheets forms a stack of layers of arrays of unit cells. The layers are configured such that bi-directional activation is caused by pairs of actuators working opposite each other. At least one of every pair of the sheets may be preformed into corrugations or into flaps to provide a predetermined mechanical bias between the pairs, or the sheets may form curv ed portions by an applied load to provide a displacement between the pairs. The sheets are preferably from about 1 .mu.m to about 100 .mu.m thick and the cells preferably have an individual displacement of from about 5 .mu.m to about 200 .mu.m.
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公开(公告)号:DE69222448D1
公开(公告)日:1997-11-06
申请号:DE69222448
申请日:1992-02-06
Applicant: HONEYWELL INC
Inventor: HOCKER BENJAMIN G , IKINWANDE AKINTUNDE I , BURNS DAVID W , HORNING ROBERT D , MIRZA AMIR R , SAATHOFF DIEDRICH J , STRATTON THOMAS G , CARNEY JAMES K
IPC: G01L9/04 , B81C1/00 , G01L9/00 , G01L9/12 , H01L21/02 , H01L21/20 , H01L21/306 , H01L29/84 , G01L9/02 , G01L9/06 , G01D5/00
Abstract: A diaphragm transducer 201 is manufactured by forming cavities in a diaphragm layer which are backfilled with a material readily removed by etching. The diaphragm layer is bonded to a silicon wafer. Access passages are provided to enable removal of the backfill material.The transducer 201 is incorporated in a three-wafer capacitive sensor 4 bonded to a pressure tube 5 with pressure ports 204 and 205 leading to access pressure ports 206.
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