中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

20 records (took 0.026 seconds)

    PROCESSABLE INORGANIC AND ORGANIC POLYMER FORMULATIONS, METHODS OF PRODUCTION AND USES THEREOF
    1.
    发明申请
    PROCESSABLE INORGANIC AND ORGANIC POLYMER FORMULATIONS, METHODS OF PRODUCTION AND USES THEREOF 审中-公开
    可加工的无机和有机聚合物配方，生产方法及其用途

    公开(公告)号：WO2009108574A2

    公开(公告)日：2009-09-03

    申请号：PCT/US2009034655

    申请日：2009-02-20

    Applicant: HONEYWELL INT INC ,  RUTTER EDWARD ,  KRISHNAMOORTHY AHILA ,  KENNEDY JOSEPH

    Inventor： RUTTER EDWARD ,  KRISHNAMOORTHY AHILA ,  KENNEDY JOSEPH

    IPC: C08L61/04 ,  C08J5/18 ,  C08K5/34 ,  C08L61/06 ,  C08L61/08 ,  C08L83/06

    CPC classification number: C08K5/3445 ,  C08G77/045 ,  C08J5/18 ,  C08J2361/04 ,  C08J2383/04 ,  C08L61/06 ,  C09D183/04

    Abstract: Polymer formulations are disclosed and described herein that comprise: at least one polymer comprising at least one hydroxy functional group, at least one acid source, and at least one acid-activated crosslinker that reacts with the polymer. In contemplated embodiments, these polymer formulations are curable at relatively low temperatures, as compared to those polymer formulations not comprising contemplated crosslinkers. Transparent films formed from these contemplated formulations are also disclosed. Organic transparent film compositions are also disclosed that comprise: at least one at least one phenol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming organic transparent films with improved transmittance by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of less than about 200°C. Inorganic transparent film compositions are disclosed that include: at least one silanol-based polymer, at least one solvent; at least one acid-activated crosslinker; and at least one acid source. Methods of forming inorganic transparent films are disclosed by depositing on a substrate the formulations disclosed herein and curing the formulations or compositions at a temperature of 200°C or less.

    Abstract translation: 本文公开和描述的聚合物制剂包含：至少一种包含至少一种羟基官能团的聚合物，至少一种酸源和至少一种与聚合物反应的酸活化的交联剂。 在预期的实施方案中，与不包含预期的交联剂的那些聚合物配方相比，这些聚合物制剂在相对低的温度下是可固化的。 还公开了由这些预期制剂形成的透明膜。 还公开了有机透明膜组合物，其包含：至少一种至少一种苯酚基聚合物，至少一种溶剂; 至少一种酸活化的交联剂; 和至少一种酸源。 通过在基底上沉积本文公开的制剂来形成有机透明薄膜的方法，所述制剂或组合物在小于约200℃的温度下固化。 公开了无机透明膜组合物，其包括：至少一种硅烷醇基聚合物，至少一种溶剂; 至少一种酸活化的交联剂; 和至少一种酸源。 通过在衬底上沉积本文公开的制剂并在200℃或更低的温度下固化该制剂或组合物来公开形成无机透明膜的方法。

    COATING COMPOSITION OPTIMIZATION FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF
    2.
    发明申请
    COATING COMPOSITION OPTIMIZATION FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF 审中-公开
    涂料组合物通过薄膜和光刻胶应用的优化及其制备方法

    公开(公告)号：WO2005041255A3

    公开(公告)日：2009-04-02

    申请号：PCT/US2004025231

    申请日：2004-08-04

    Applicant: HONEYWELL INT INC ,  KENNEDY JOSEPH ,  STUCK JASON

    Inventor： KENNEDY JOSEPH ,  STUCK JASON

    IPC: C04B41/50 ,  H01L20060101

    CPC classification number: H01L21/3122 ,  C09D183/04 ,  C09D183/16 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3124 ,  H01L21/31695 ,  H01L21/76808

    Abstract: A sacrificial coating material includes: at least one inorganic compound, and at least one material modification agent, wherein the sacrificial coating material is dissolvable in an alkaline-based chemistry or a fluorine-based chemistry. A method of producing a sacrificial coating material includes: providing at least one inorganic compound, providing at least one material modification agent, combining the at least one inorganic compound with the at least one material modification agent to form the sacrificial coating material, wherein the sacrificial coating material is dissolvable in an alkaline-based chemistry or a fluorine-based chemistry, but not organic casting solvents commonly used in organic BARC materials.

    Abstract translation: 牺牲涂层材料包括：至少一种无机化合物和至少一种材料改性剂，其中牺牲涂层材料可溶于碱性化学或氟基化学。 制造牺牲涂料的方法包括：提供至少一种无机化合物，提供至少一种材料改性剂，将至少一种无机化合物与至少一种材料改性剂组合以形成牺牲涂料，其中牺牲 涂料可溶于碱性化学物质或氟基化学物质，但不溶于有机BARC材料中通常使用的有机浇铸溶剂。

    PLANARIZATION FILMS FOR ADVANCED MICROELECTRONIC APPLICATIONS AND DEVICES AND METHODS OF PRODUCTION THEREOF
    4.
    发明申请
    PLANARIZATION FILMS FOR ADVANCED MICROELECTRONIC APPLICATIONS AND DEVICES AND METHODS OF PRODUCTION THEREOF 审中-公开
    用于高级微电子应用的平面薄膜及其制造方法

    公开(公告)号：WO2005017617A8

    公开(公告)日：2006-06-01

    申请号：PCT/US0334347

    申请日：2003-10-27

    Applicant: HONEYWELL INT INC ,  HUANG WEI ,  KENNEDY JOSEPH ,  KATSANES RONALD

    Inventor： HUANG WEI ,  KENNEDY JOSEPH ,  KATSANES RONALD

    IPC: B05D5/12 ,  B32B27/42 ,  C08J3/00 ,  C08J7/02 ,  G03C1/00

    CPC classification number: C08J7/02 ,  C04B26/12 ,  C04B2111/00482 ,  C08J2361/00 ,  C23F1/10 ,  C23F1/44 ,  C23F3/00 ,  C23F3/04 ,  H01L21/31051 ,  H01L21/312 ,  Y10T428/31942 ,  C04B2103/0093 ,  C04B2103/40

    Abstract: A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.

    Abstract translation: 本文公开了一种平面化组合物，其包括：a）结构成分; 和b）溶剂体系，其中所述溶剂体系与所述结构组分相容并降低所述平坦化组合物的至少一种分子间力或表面力组分。 还公开了包含该平坦化组合物的膜。 此外，本文公开了另外的平坦化组合物，其包括：a）甲酚基聚合物化合物; 和b）包含至少一种醇和至少一种乙酸乙烯酯类溶剂的溶剂体系。 还公开了包含该平坦化组合物的膜。 本文还公开了一种分层组件，其包括：a）具有表面形貌的衬底; 和b）平面化组合物或诸如本文所述的那些的膜，其中所述组合物与所述基材偶联。 本文还公开了形成平坦化组合物的方法，其包括：a）提供结构成分; b）提供溶剂体系，其中所述溶剂体系与所述结构组分相容并降低所述平坦化组合物的分子间力或表面力组分中的至少一种; 和c）将结构成分和溶剂体系混合以形成平坦化组合物。 还公开了形成膜的方法，其包括：a）提供诸如本文公开的那些的平坦化组合物; 和b）蒸发至少部分溶剂系统以形成膜。

    ANTIREFLECTIVE COATINGS FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF
    5.
    发明申请
    ANTIREFLECTIVE COATINGS FOR VIA FILL AND PHOTOLITHOGRAPHY APPLICATIONS AND METHODS OF PREPARATION THEREOF 审中-公开
    用于通过薄膜和光刻机应用的抗反射涂层及其制备方法

    公开(公告)号：WO2005049681A3

    公开(公告)日：2006-04-20

    申请号：PCT/US2004038517

    申请日：2004-11-17

    Applicant: HONEYWELL INT INC ,  LI BO ,  KENNEDY JOSEPH ,  IWAMOTO NANCY ,  LU VICTOR ,  LEUNG ROGER ,  FRADKIN MARK A ,  HUSSEIN MAKAREM A ,  GOODNER MICHAEL D

    Inventor： LI BO ,  KENNEDY JOSEPH ,  IWAMOTO NANCY ,  LU VICTOR ,  LEUNG ROGER ,  FRADKIN MARK A ,  HUSSEIN MAKAREM A ,  GOODNER MICHAEL D

    IPC: G03C1/825 ,  C08G20060101 ,  C08L83/04 ,  C09D183/04 ,  C09D183/08 ,  G03C1/83 ,  G03F7/09

    CPC classification number: C09D183/04 ,  C09D183/08 ,  G03F7/0751 ,  G03F7/0752 ,  G03F7/091

    Abstract: An absorbing composition is described herein that includes at least one inorganic­based compound, at least one absorbing compound, and at least one material modification agent. In addition, methods of making an absorbing composition are also described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) allowing the reaction mixture to form the absorbing composition at room temperature. Another method of making an absorbing composition includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, an acid/water mixture, and one or more solvents to form a reaction mixture; and b) heating the reaction mixture to form the absorbing composition. Yet another method of making an absorbing composition is described that includes: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) heating the reaction mixture to form an absorbing material, a coating or a film. In other methods of making an absorbing composition described herein, those methods include: a) combining at least one inorganic-based compound, at least one absorbing compound, at least one material modification agent, and one or more solvents to form a reaction mixture, wherein the at least one material modification agent comprises at least one acid and water; and b) allowing the reaction mixture to form an absorbing material, a coating or a film.

    Abstract translation: 本文描述的吸收组合物包括至少一种无机基化合物，至少一种吸收化合物和至少一种材料改性剂。 此外，还描述了制备吸收组合物的方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂 形成反应混合物; 和b）使反应混合物在室温下形成吸收组合物。 制备吸收组合物的另一种方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂，酸/水混合物和一种或多种溶剂组合以形成反应混合物; 和b）加热反应混合物以形成吸收组合物。 描述了制备吸收组合物的另一种方法，其包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物，其中 至少一种材料改性剂包含至少一种酸和水; 和b）加热反应混合物以形成吸收材料，涂层或膜。 在制备本文所述的吸收组合物的其它方法中，这些方法包括：a）将至少一种无机基化合物，至少一种吸收化合物，至少一种材料改性剂和一种或多种溶剂组合以形成反应混合物， 其中所述至少一种材料改性剂包含至少一种酸和水; 和b）使反应混合物形成吸收材料，涂层或膜。

    SPIN-ON ANTI-REFLECTIVE COATINGS FOR PHOTOLITHOGRAPHY
    8.
    发明公开
    SPIN-ON ANTI-REFLECTIVE COATINGS FOR PHOTOLITHOGRAPHY 审中-公开
    自旋ANTI REFLEX涂料光刻

    公开(公告)号：EP1472574A4

    公开(公告)日：2005-06-08

    申请号：EP01996057

    申请日：2001-11-15

    Applicant: HONEYWELL INT INC

    Inventor： BALDWIN TERESA ,  KENNEDY JOSEPH

    IPC: G03F7/11 ,  C08G77/00 ,  C08G77/04 ,  C09D1/00 ,  C09D5/32 ,  C09D7/12 ,  C09D183/04 ,  C09K3/00 ,  G03C1/492 ,  G03F7/09 ,  H01L21/027

    CPC classification number: G03F7/091 ,  C08G77/04 ,  C09D5/006 ,  C09D183/04 ,  Y10T428/31663

    Abstract: Anti-reflective coating materials for ultraviolet photolithography include at least one absorbing compounds and at least one pH tuning agent that are incorporated into spin-on materials. Suitable absorbing compounds are those that absorb around wavelengths such as 365 nm, 248 nm, 193 nm and 157 nm that may be used in photolithography. Suitable pH tuning agents not only adjust the pH of the final spin-on composition, but also influence the chemical performance and characteristics, mechanical performance and structural makeup of the final spin-on composition that is part of the layered material, electronic component or semiconductor component, such that the final spin-on composition is more compatible with the resist material that is coupled to it. More specifically, the pH tuning agent strong influences the polymeric characteristics, the structural makeup and the spatial orientation that results in increasing the surface properties of the anti-reflective coating for optimal resist performance. In other words, a pH tuning agent that merely adjusts the pH of the spin-on material without influencing the mechanical properties and structural makeup of the spin-on composition or the coupled resist material is not contemplated herein. A method of making absorbing and pH tuned spin-on materials includes combining at least one organic absorbing compound and at least one pH tuning agent with at least one silane reactant during synthesis of the spin-on materials and compositions.

    PLANARIZATION FILMS FOR ADVANCED MICROELECTRONIC APPLICATIONS AND DEVICES AND METHODS OF PRODUCTION THEREOF
    9.
    发明公开
    PLANARIZATION FILMS FOR ADVANCED MICROELECTRONIC APPLICATIONS AND DEVICES AND METHODS OF PRODUCTION THEREOF 审中-公开
    平坦化膜晚期微电撕扯应用和机构及其制造方法

    公开(公告)号：EP1649322A4

    公开(公告)日：2007-09-19

    申请号：EP03777970

    申请日：2003-10-27

    Applicant: HONEYWELL INT INC

    Inventor： HUANG WEI ,  KENNEDY JOSEPH ,  KATSANES RONALD

    IPC: G03C1/00 ,  B05D5/12 ,  B32B27/42 ,  C08J3/00 ,  C08J7/02

    CPC classification number: C08J7/02 ,  C04B26/12 ,  C04B2111/00482 ,  C08J2361/00 ,  C23F1/10 ,  C23F1/44 ,  C23F3/00 ,  C23F3/04 ,  H01L21/31051 ,  H01L21/312 ,  Y10T428/31942 ,  C04B2103/0093 ,  C04B2103/40

    Abstract: A planarization composition is disclosed herein that comprises: a) a structural constituent; and b) a solvent system, wherein the solvent system is compatible with the structural constituent and lowers the lowers at least one of the intermolecular forces or surface forces components of the planarization composition. A film that includes this planarization composition is also disclosed. In addition, another planarization composition is disclosed herein that comprises: a) a cresol-based polymer compound; and b) a solvent system comprising at least one alcohol and at least one ether acetate-based solvent. A film that includes this planarization composition is also disclosed. A layered component is also disclosed herein that comprises: a) a substrate having a surface topography; and b) a planarization composition or a film such as those described herein, wherein the composition is coupled to the substrate. Methods of forming a planarization compositions are also disclosed herein that comprise: a) providing a structural constituent; b) providing a solvent system, wherein the solvent system is compatible with the structural constituent and lowers at least one of the intermolecular forces or surface forces components of the planarization composition; and c) blending the structural constituent and the solvent system to form a planarization composition. Methods of forming a film are also disclosed that comprise: a) providing a planarization composition such as those disclosed herein; and b) evaporating at least part of the solvent system to form a film.

Patent Agency Ranking