METHODS AND STRUCTURE FOR IMPROVING WAFER BOW CONTROL
    1.
    发明申请
    METHODS AND STRUCTURE FOR IMPROVING WAFER BOW CONTROL 审中-公开
    改进晶圆弓控制的方法和结构

    公开(公告)号:WO2004064090A3

    公开(公告)日:2004-09-10

    申请号:PCT/US2004000021

    申请日:2004-01-05

    CPC classification number: B81C1/00666 B81C2201/0167 Y10T74/12

    Abstract: A method for controlling bow in wafers (50) which utilize doped layers is described. The method includes depositing a silicon-germanium layer (52) onto a substrate (14), depositing an undoped buffer layer (56) onto the silicon-germanium layer, and depositing a silicon-boron layer (58) onto the undoped layer.

    Abstract translation: 描述了一种用于控制利用掺杂层的晶片(50)中的弓的方法。 该方法包括在衬底(14)上沉积硅 - 锗层(52),在硅 - 锗层上沉积未掺杂的缓冲层(56),并且在未掺杂的层上沉积硅 - 硼层(58)。

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