公开(公告)号：DE60314719T2

公开(公告)日：2008-04-10

申请号：DE60314719

申请日：2003-01-07

Applicant: HONEYWELL INT INC

Inventor： APEN PAUL G ,  ZHEREBIN RUSLAN ,  LI BO ,  KOROLEV BORIS A ,  LAU KREISLER S ,  KANSCHIK-CONRADSEN ANDREAS ,  KELLERMEIER BERND ,  DEMEL SONJA ,  WERNER CHRISTIAN ,  SULLIVAN EDWARD J

IPC: C07C13/615 ,  C08G61/12 ,  C07C13/68 ,  C08F38/02 ,  C08F290/00 ,  C08G61/02 ,  H01B3/30 ,  H01L21/768 ,  H01L23/522

Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.

公开(公告)号：AU2003224597A1

公开(公告)日：2003-07-30

申请号：AU2003224597

申请日：2003-01-14

Applicant: HONEYWELL INT INC

Inventor： LAU KREISLER S ,  APEN PAUL G ,  LI BO ,  SULLIVAN EDWARD J

IPC: C07C17/10 ,  C07C17/266 ,  C07C25/22 ,  C07C25/24 ,  C08G61/02 ,  C08L65/00 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L23/14 ,  H01L23/532 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H01L51/30 ,  C08J9/26

Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.

公开(公告)号：DE60314719D1

公开(公告)日：2007-08-16

申请号：DE60314719

申请日：2003-01-07

Applicant: HONEYWELL INT INC

Inventor： APEN PAUL G ,  ZHEREBIN RUSLAN ,  LI BO ,  KOROLEV BORIS A ,  LAU KREISLER S ,  KANSCHIK-CONRADSEN ANDREAS ,  KELLERMEIER BERND ,  DEMEL SONJA ,  WERNER CHRISTIAN ,  SULLIVAN EDWARD J

IPC: C07C13/615 ,  C08G61/12 ,  C07C13/68 ,  C08F38/02 ,  C08F290/00 ,  C08G61/02 ,  H01B3/30 ,  H01L21/768 ,  H01L23/522

Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.

公开(公告)号：AU2003224597A8

公开(公告)日：2003-07-30

申请号：AU2003224597

申请日：2003-01-14

Applicant: HONEYWELL INT INC

Inventor： LI BO ,  LAU KREISLER S ,  SULLIVAN EDWARD J ,  APEN PAUL G

IPC: C07C17/10 ,  C07C17/266 ,  C07C25/22 ,  C07C25/24 ,  C08G61/02 ,  C08L65/00 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L23/14 ,  H01L23/532 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  C08L49/00 ,  C08J9/26

Abstract: The present invention provides a composition comprising (a) thermosetting component comprising: (1) optionally monomer of Formula I as set forth below and (2) at least one oligomer or polymer of Formula II as set forth below where E, Q, G, h, I, j, and w are as set forth below and (b) porogen that bonds to thermosetting component (a). Preferably, the porogen is selected from the group consisting of unsubstituted polynorbornene, substituted polynorbornene, polycaprolactone, unsubstituted polystyrene, substituted polystyrene, polyacenaphthylene homopolymer, and polyacenaphthylene copolymer. Preferably, the present compositions may be used as dielectric substrate in microchips, multichip modules, laminated circuit boards, or printed wiring boards.

公开(公告)号：AU2003202905A1

公开(公告)日：2003-07-24

申请号：AU2003202905

申请日：2003-01-07

Applicant: HONEYWELL INT INC

Inventor： SULLIVAN EDWARD J ,  APEN PAUL G ,  ZHEREBIN RUSLAN ,  LI BO ,  KOROLEV BORIS A ,  LAU KREISLER S ,  KANSCHIK-CONRADSEN ANDREAS ,  KELLERMEIER BERND ,  DEMEL SONJA ,  WERNER CHRISTIAN

IPC: C07C13/615 ,  C07C13/68 ,  C08F38/02 ,  C08F290/00 ,  C08G61/02 ,  C08G61/12 ,  H01B3/30 ,  H01L21/768 ,  H01L23/522

Abstract: The present invention provides adamantane or diamantane compositions that are useful as a dielectric material in microelectronic applications such as microchips.