Abstract:
A half-tone film is formed on a transparent substrate (6) by sputtering reactive gas on substrate using a target (5) containing metal and silicon, such that a desired half-tone film optical characteristic is obtained, irrespective of change of the flow amount of gas. The reactive gas is oxygen, carbon, nitrogen or fluorine. An Independent claim is also included for a half-tone-type phase shift mask blank.
Abstract:
A half-tone film is formed on a transparent substrate (6) by sputtering reactive gas on substrate using a target (5) containing metal and silicon, such that a desired half-tone film optical characteristic is obtained, irrespective of change of the flow amount of gas. The reactive gas is oxygen, carbon, nitrogen or fluorine. An Independent claim is also included for a half-tone-type phase shift mask blank.
Abstract:
PROBLEM TO BE SOLVED: To provide a sputtering target or the like capable of preventing deviation in the direction of gravity when used for the sputter of the inclined system, and reducing abnormality attributable to the deviation. SOLUTION: In the sputtering target 2 having a backing plate 5 and a target material 4 joined with the backing plate 5 by bonding agent 30, the target material 4 has a projecting shape shown in the figure, and the backing plate 5 is fitted to the projecting shape of the target material 4. When the sputtering target is inclined, the target material is not moved in the direction of gravity. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To prevent any increase of the number of particles attributable to deposits fallen from a non-erosion region of a sputtering target during the film deposition by the sputtering method.SOLUTION: This method for manufacturing a mask blank having a thin film on a main surface of a substrate, includes a step of obtaining the size of an erosion area of a sputtered surface of a target for each of a plurality of layers when forming each of the plurality of layers by the sputtering method while the thin film contains the plurality of layers to be respectively formed by the sputtering method by using the same target, a step of selecting the target having the sputtered surface of the same size or the smaller size than that of the erosion area of the minimum size out of the plurality of erosion areas, and a step of respectively forming the plurality of layers by the sputtering method by using the selected target.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a halftone phase shift mask blank with uniform quality and little scatter in the optical characteristics in mass-production. SOLUTION: The method for manufacturing a halftone phase shift mask blank having a phase shift film containing at least one layer of a halftone film on a transparent substrate includes a process of forming the halftone film on the transparent substrate by reactive sputtering in an atmosphere containing a reactive gas by using a target containing metal and silicon. The process of forming the halftone film by the reactive sputtering is carried out under the condition of the flow rate of the reactive gas selected from a region where the discharge characteristics are stable against changes in the flow rate of the reactive gas, and by using a target with a selected composition ratio of the metal and silicon so as to obtain desired optical characteristics of the halftone film. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank, a manufacturing method of the mask blank, or the like, in which in-plane uniformity of transmittance falls within a predetermined allowable range after heat treatment and forced cooling treatment.SOLUTION: There is provided a mask blank in which a translucent substrate 1 includes a thin film 2 for forming a transfer pattern is on its main surface. The thin film 2 is made of a material which consists of silicon and nitrogen or a material in which one or more elements selected from a semimetal element, a non-metal element and rare gas is contained in the material which consists of silicon and nitrogen, the thin film 2 has, on its surface layer, an oxide layer 22 which has larger oxygen content than a thin film 21 in a region other than the surface layer, the thin film 2 is formed such that thickness of the central part is thicker than thickness of a periphery part on a main surface side, and the oxide layer 22 is formed such that thickness of the central part is thicker than thickness of a periphery part on the main surface side.