Abstract:
PURPOSE: A method for manufacturing a multi gray scale photo mask and a method for manufacturing a semiconductor transistor are provided to suppress a dark defect by preventing the de-lamination of a resist pattern. CONSTITUTION: A semi-transmitting layer(102) and a shielding layer(103) are successively formed on a transmitting substrate(101). A mask blank with a first resist layer is formed on the uppermost layer. A pattern is drawn and developed on the first resist layer. A transmitting unit(111) is formed with the first resist pattern and the shielding layer pattern. A second resist layer is formed to cover the substrate by removing the first resist pattern. A pattern is drawn and developed on the second resist layer and a second resist pattern is formed. A semi-transmitting unit(112) and a shielding unit(113) are formed.
Abstract:
PROBLEM TO BE SOLVED: To provide a multi-tone photomask of which the variation of in-plane transmittance can be reduced, and to provide a method of manufacturing the same. SOLUTION: In the method of manufacturing the multi-tone photomask, a light-shielding film and a semi-transmissive film transmitting a portion of exposure light are formed on a transparent substrate and are respectively patterned as prescribed to form a transfer pattern including a light-shielding part, a semi-transmissive part transmitting a portion of exposure light, and a light-transmissive part. In this method, the semi-transmissive film and the light-shielding film are patterned by wet etching to form the transfer pattern, and at least part of the semi-transmissive film of the transfer pattern is subjected to surface modification treatment to change an exposure light transmittance of the semi-transmissive film, whereby a transmittance in-plan distribution range of the semi-transmissive part existing in the transfer pattern is reduced. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To finely regulate transmittance of a translucent part and to select wavelength dependence of the transmittance of the translucent part to exposure light. SOLUTION: In the multi-gradation photomask, a predetermined transfer pattern including a light-shielding part, a light-transmitting part, and a translucent part is formed on a transparent substrate. In the light-shielding part, a translucent film and a light-shielding film are layered on the transparent substrate. In the light-transmitting part, the transparent substrate is exposed. In the translucent part, the translucent film formed on the transparent substrate is exposed. The translucent film includes a first translucent layer and a second translucent layer layered on the first translucent layer, and the film thickness of the second translucent layer constituting the translucent part is reduced to be smaller than that of the second translucent layer constituting the light-shielding part. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To suppress a resist pattern from peeling and to suppress generation of black defects. SOLUTION: A method for manufacturing a multilevel grayscale photomask is provided, including steps of: preparing a mask blank having a semitransparent film and a light-shielding film formed in this order on a light-transmitting substrate and having a first resist film formed on the outermost layer; forming a light-shielding film pattern by etching the light-shielding film using the first resist pattern as a mask and forming a light-transmitting portion by etching the semitransparent film using the first resist pattern or the light-shielding film pattern as a mask; forming a second resist film covering the whole surface of the substrate which is obtained by removing the first resist pattern; and forming a semitransparent portion and a light-shielding portion by etching the light-shielding film pattern using the second resist pattern as a mask. In the step of forming the second resist film, prior to forming the second resist film, an exposed surface of the light-transmitting substrate appearing by the formation of the light-transmitting portion is subjected to a surface treatment with a Si-containing organic compound. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a photomask blank, suppressing a changes in thickness of a resist film, and also to provide a method for manufacturing a photomask, and a coating device. SOLUTION: In the method for manufacturing a photomask blank, a resist liquid 21 elevated by a coating means 2 that includes a liquid tank 20 and a coating nozzle 22 elevating the resist liquid 21 reserved in the liquid tank 20 by a capillary phenomenon, is brought into contact with the objective surface 10a to be coated of a substrate 10 facing downward, and the coating nozzle 22 and the substrate 10 are relatively moved to form a resist film 21 on the objective surface 10a of the substrate 10. The resist film is formed by the coating means 2 having at least a liquid surface area of the resist liquid 21 in the liquid tank 20, the liquid surface area necessary to control the change in thickness of the resist film to be within a tolerance, which is determined based on the relationship between a height reduction d of the surface of the resist liquid in the liquid tank 20, the height reduced by the consumption of the resist liquid 21 by application of the resist liquid 21 on the substrate 10, and the change in thickness of the resist film formed on the coated surface 10a of the substrate 10. COPYRIGHT: (C)2010,JPO&INPIT
Abstract translation:要解决的问题:提供一种制造光掩模坯料的方法,抑制抗蚀剂膜的厚度变化,以及提供一种制造光掩模的方法和涂覆装置。 解决方案:在制造光掩模坯料的方法中,由涂覆装置2升高的抗蚀剂液体21,其包括液体罐20和涂覆喷嘴22,其通过毛细管现象提升保留在液体罐20中的抗蚀剂液体21 与要面向下方的基板10的待涂覆的物镜10a接触,并且涂布喷嘴22和基板10相对移动,以在基板10的物镜表面10a上形成抗蚀剂膜21.抗蚀剂 膜由具有液体槽20中的抗蚀剂液体21的至少液面积的涂布装置2形成,控制抗蚀剂膜的厚度变化所必需的液面积在公差以内 基于液体罐20中的抗蚀剂液体的表面的高度减小度d之间的关系,通过将抗蚀剂液体21施加在基材上而消除抗蚀剂液体21而降低的高度 te 10,以及形成在基板10的涂覆表面10a上的抗蚀剂膜的厚度变化。版权所有(C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a multilevel gradation photomask to be used for manufacturing a TFT substrate or the like, wherein even when fluctuation in the residual film thickness of a resist exposed through a transflective part is adjusted by a photoirradiation amount, less influence is given to the pattern in another part. SOLUTION: The multilevel gradation photomask 10 comprises a glass substrate 11, a light shielding part 12 where a light-shielding film is formed on the glass substrate 11, a transflective part 13 where a transflective film is formed, a light-transmitting part 14 where neither the light-shielding film nor the transflective film is formed, and a light-shielding part periphery 15 where a transflective film having a prescribed width is formed in a periphery of the light-shielding part 12, the periphery functioning as a boundary against the light-transmitting part 14. COPYRIGHT: (C)2010,JPO&INPIT