Abstract:
PROBLEM TO BE SOLVED: To provide an integrated circuit protected against reverse engineering, and to provide a method of fabricating the same. SOLUTION: A semiconductor device includes: a field oxide layer 4 disposed on a semiconductor substrate having an opening for limiting a contact region of the semiconductor substrate; a metal plug contact 7 disposed on a portion of the field oxide located within the contact region; and a metal 10 connected to the metal plug contact, wherein the metal plug contact contacts the portion of the field oxide layer, and the portion of the field oxide layer insulates the metal plug contact from the contact region. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique for and structures for camouflaging an integrated circuit structure against reverse engineering. SOLUTION: The integrated circuit structure is composed of a plurality of layers of material having a controlled outline. A layer of silicide metal is disposed in active areas of the substrate and has a gap over a channel connecting adjacent active areas. The channel has a channel block structure, which appears identical under reverse engineering whether it is made conductive or insulative. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit (IC) protection method cheep and easy for mounting helpful to make it impossible to actualize reverse engineering of the IC to prevent the reverse engineering of the IC specifically by making a reverse enginner very difficult to finding out the real contact of each source and drain. SOLUTION: A semiconductor device including the IC having a metal trace connected to a field oxide is provided with a reverse engineering protection. The metallization is usually connected to the gate, source, or drain of a circuit but not to an insulated field oxide, so as to make the reverse enginner make a mistake. The method is for forming the device. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
An integrated circuit structure for MOS-type devices comprising a silicon substrate of a first conductivity type; a first gate insulating regions selectivelyplaced over the silicon substrate of the first conductivity type; a first polycrystallinesilicon layer selectively placed over the silicon substrate of the first conductivity type;a second gate insulating regions selectively placed over the first gate insulating regionsand the first polycrystalline silicon layer; a second polycrystalline silicon layer selectivelyplaced over the second gate insulating regions; first buried silicon regions of a second conductivity type, buried within the silicon substrate of the first conductivity type, placedunder the first polycrystalline silicon layer and in contact therewith; and second buriedsilicon regions of the second conductivity type, buried within the silicon substrate of the first conductivity type, placed under the second gate insulating regions, under the secondpolycrystalline silicon layer and insulated therefrom.
Abstract:
A technique for and structres for camouflaging an integrated circuit structure. A layer ofconductive material having a controlled outline is disposed to provide artifact edges of the conductive material that resemble an operable device when in fact the device is not operable.
Abstract:
A technique for and structures for camouflaging an integrated circuit structure. A layer of conductive material having a controlled outline is disposed to provide artifact edges of the conductive material that resemble an operable device when in fact the device is not operable.
Abstract:
An integrated circuit is protected from reverse engineering by providing conducting and non-conducting channels which appear identical. Active regions 22, 26 are connected by channel areas 23, 25 and pseudo channel-block structure 29 all of the same conductivity type. A layer of metal silicide is disposed over the active regions 22, 26 and channel areas 23, 25 but not the pseudo channel block structure 29. When reverse engineering techniques are applied edge artefacts 28 of the silicide covering a pseudo channel-blocked conducting channel appear identical to those of a non-conducting channel-blocked channel (figure 1B).
Abstract:
A technique for and structures for camouflaging an integrated circuit structure against reverse engineering. The integrated circuit structure is formed by a plurality of layers of material having a controlled outline. A layer of silicide metal is disposed over active areas of the substrate and has a gap over a channel connecting adjacent active areas. The channel has a channel block structure, which appears identical under reverse engineering whether it is made conductive or insulative.