FABRICATION OF OHMIC CONTACTS TO INP USING NON- STOICHIOMETRIC INP LAYERS
    4.
    发明申请
    FABRICATION OF OHMIC CONTACTS TO INP USING NON- STOICHIOMETRIC INP LAYERS 审中-公开
    使用非超声波输入层输入OHMIC接触的制造

    公开(公告)号:WO0068982A9

    公开(公告)日:2002-06-13

    申请号:PCT/US0012294

    申请日:2000-05-04

    Applicant: HRL LAB LLC

    CPC classification number: B82Y15/00 H01L21/28575 H01L29/452

    Abstract: A method of reducing the specific contact resistivity of a metal to semiconductor interface between a metal contact and an InP semiconductor compound. The method includes the step of increasing the amount of the group V element (P) in the semiconductor compound so that the semiconductor compound is non-stoichiometric having an excess concentration of the group V element in an amount of at least 0.1% above stoichiometric levels.

    Abstract translation: 一种降低金属与InP半导体化合物之间的金属与半导体界面的比接触电阻率的方法。 该方法包括增加半导体化合物中的V族元素(P)的量的步骤,使半导体化合物的非化学计量比V族元素的过量浓度高于化学计量值的至少0.1% 。

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