Device and method for cooling a unit

    公开(公告)号:US10132560B2

    公开(公告)日:2018-11-20

    申请号:US14343656

    申请日:2012-08-14

    Applicant: Heinz Schmidt

    Inventor: Heinz Schmidt

    Abstract: The present invention relates to a method and a device (1) for cooling an arrangement (2) using a cold head (3), with a thermal cooling of the unit (2) to be cooled by means of the thermosiphon principle. At the same time, heat is conducted via a mechanical heat bridge (5), which provides a direct thermal connection from the cold head (3) to the unit (2) to be cooled.

    COOLING FOR SUPERCONDUCTING MACHINES
    7.
    发明申请
    COOLING FOR SUPERCONDUCTING MACHINES 审中-公开
    用于超级连接机的冷却

    公开(公告)号:US20120073787A1

    公开(公告)日:2012-03-29

    申请号:US13322856

    申请日:2010-05-25

    Abstract: A device for cooling superconducting machines has a closed thermal siphon system which can be filled with a liquid coolant and has an evaporator for evaporating the liquid coolant. In order to improve the cooling performance of the device, the surface area of the evaporator which can be wetted with the liquid coolant is increased.

    Abstract translation: 用于冷却超导机器的装置具有闭合的热虹吸系统,其可以填充液体冷却剂并具有用于蒸发液体冷却剂的蒸发器。 为了提高装置的冷却性能,可以使用液体冷却剂润湿的蒸发器的表面积增加。

    Electronic module
    10.
    发明授权
    Electronic module 失效
    电子模块

    公开(公告)号:US4969066A

    公开(公告)日:1990-11-06

    申请号:US373398

    申请日:1989-06-30

    CPC classification number: H05K7/1422 H05K1/145 H05K7/142

    Abstract: An electronic module includes two printed-circuit boards which are equipped with hybrid assemblies. The electronic module takes up only a small amount of space and, at the same time, efficiently dissipates the heat loss caused by the hybrid assemblies. The hybrid assemblies are arranged in such a manner that they can be interspersed with one another, similar to a sandwich-type construction. The interspersing provides duct-type, perpendicularly aligned interspaces between the hybrid assemblies, allowing the heat loss to be dissipated in a chimney-like fashion.

    Abstract translation: 电子模块包括两个配有混合组件的印刷电路板。 电子模块仅占用少量空间,同时有效地消散由混合组件引起的热损失。 混合组件以这样的方式布置,使得它们可以彼此散布,类似于夹层结构。 散布在混合组件之间提供管道型垂直对准的间隙,允许以烟囱状的方式消散热损失。

Patent Agency Ranking