公开(公告)号：JP2001127025A

公开(公告)日：2001-05-11

申请号：JP2000273239

申请日：2000-09-08

Applicant: IBM

Inventor： KARL E BOGGS ,  KENNETH M DAVIS ,  WILLIAM F LANDERS ,  MICHAEL F ROFARO ,  ADAM D TEIKKUNOA ,  RONALD D FIIJII

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16 ,  H01L21/302 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing(CMP) control system for controlling pressure distribution on the back face of a semiconductor wafer to be polished. SOLUTION: This system is provided with a CMP device having a carrier 14 for supporting a semiconductor wafer. The carrier 14 is provided with plural two-way function piezoelectric actuators 41 and 42. The actuators 41 and 42 detect pressure change across the semiconductor wafer, and the actuators 41 and 42 can be individually controlled. A controller connected with the actuators 41 and 42 control the actuators 41 and 42 to apply pressure distribution controlled across the semiconductor wafer by monitoring the detected pressure change.