公开(公告)号：JP2001077067A

公开(公告)日：2001-03-23

申请号：JP22834999

申请日：1999-08-12

Applicant: IBM ,  SIEMENS AG

Inventor： KARL E BOGGS ,  CHENTEIN RIN ,  NUETZEL JOACHIM F ,  ROBERTO PUREESURU ,  MARIA RONAI ,  SCHNABEL FLORIAN ,  JERIMY K STEPHAN

IPC: H01L21/304 ,  B24B37/013 ,  B24B49/12 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/66 ,  H01L23/544 ,  B24B37/04

Abstract: PROBLEM TO BE SOLVED: To enable a metal chemical mechanical polishing process to be quickly controlled in performance by a method wherein an indicator region on a wafer is checked, and a chemical mechanical polishing machine is regulated in operation corresponding to a check result. SOLUTION: An indicator region is capable of containing a macro block composed of a large number of blocks. In the above indicator region, a maximum line width is 20 μm at a given mask level, and a 90% maximum pattern factor is possible. A wafer is completely dished out through this preferable arrangement or checked by discriminating a block which partially becomes zero in thickness. A block 86 which is completely dished out is distinguished from not only a block 91 where a dish liner is not exposed but also a block 90 which is partially dished. A chemical mechanical polishing machine is controlled in operation corresponding to the check result.

公开(公告)号：JP2001127025A

公开(公告)日：2001-05-11

申请号：JP2000273239

申请日：2000-09-08

Applicant: IBM

Inventor： KARL E BOGGS ,  KENNETH M DAVIS ,  WILLIAM F LANDERS ,  MICHAEL F ROFARO ,  ADAM D TEIKKUNOA ,  RONALD D FIIJII

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16 ,  H01L21/302 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing(CMP) control system for controlling pressure distribution on the back face of a semiconductor wafer to be polished. SOLUTION: This system is provided with a CMP device having a carrier 14 for supporting a semiconductor wafer. The carrier 14 is provided with plural two-way function piezoelectric actuators 41 and 42. The actuators 41 and 42 detect pressure change across the semiconductor wafer, and the actuators 41 and 42 can be individually controlled. A controller connected with the actuators 41 and 42 control the actuators 41 and 42 to apply pressure distribution controlled across the semiconductor wafer by monitoring the detected pressure change.

公开(公告)号：SG87156A1

公开(公告)日：2002-03-19

申请号：SG200004528

申请日：2000-08-16

Applicant: IBM

Inventor： KARL E BOGGS ,  KENNETH M DAVIS ,  WILLIAM F LANDERS ,  MICHAEL F LOFARO ,  ADAM D TICKNOR ,  RONALD D FIEGE

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16 ,  H01L21/302 ,  H01L21/304

Abstract: A chemical-mechanical polishing (CMP) control system controls distribution of pressure across the backside of a semiconductor wafer being polished. The system includes a CMP apparatus having a carrier for supporting a semiconductor wafer. The carrier includes a plurality of dual function piezoelectric actuators. The actuators sense pressure variations across the semiconductor wafer and are individually controllable. A control is connected to the actuators for monitoring sensed pressure variations and controlling the actuators to provide a controlled pressure distribution across the semiconductor wafer.