Abstract:
The functionality of a programmable memory built-in self-test (BIST) arrangement for testing an embedded memory structure of an integrated circuit is extended to system level testing to ascertain operability of the system after the integrated circuits and boards including them have been placed in service in larger systems, by generating default test signals which are loaded in an instruction store module when test instructions are not provided from an external tester. This additional utility of the BIST arrangement, increases efficiency of chip space utilization and improves the system level test. Loading of test instructions from an external tester during chip manufacture and/or board assembly is unaffected.
Abstract:
PROBLEM TO BE SOLVED: To provide a device for testing a memory having a write cycle and read cycle. SOLUTION: A BIST state machine 60 and XOR circuit 68 change the data impressed upon the DI port of a memory to a value which is different from that of the data stored at a currently addressed memory position in a read cycle. In addition, the value of anticipated data generated by the BIST becomes different front that of the data on the DI port side of the memory, but the same as that of the data stored at the current memory address. When this constitution is used, such a flash through defect which could not be detected with the conventional BIST machine becomes detectable.
Abstract:
The functionality of a programmable memory built-in self-test (BIST) arrangement for testing an embedded memory structure of an integrated circuit is extended to system level testing to ascertain operability of the system after the integrated circuits and boards including them have been placed in service in larger systems, by generating default test signals which are loaded in an instruction store module when test instructions are not provided from an external tester. This additional utility of the BIST arrangement, increases efficiency of chip space utilization and improves the system level test. Loading of test instructions from an external tester during chip manufacture and/or board assembly is unaffected.