公开(公告)号：GB2286084A

公开(公告)日：1995-08-02

申请号：GB9500965

申请日：1995-01-18

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/12 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K7/20 ,  H05K1/18 ,  H05K3/34

Abstract: An electronic package includes a rigid support member 31, e.g. a copper sheet, to which is bonded both the packager's semiconductor chip 41 and a circuitized substrate 15. The chip 41 is bonded using a thermally conductive adhesive 53 while the circuitized substrate 15, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip 41 is electrically coupled to designated parts of the circuitry of the substrate 15, preferably by wire, 49, thermocompression or thermosonic bonding. An encapsulant 51 may be used to cover and protect the connections between the chip 41 and substrate 15. This package may in turn be electrically coupled to a separate, second substrate 27 such as a PCB.

公开(公告)号：GB2286084B

公开(公告)日：1998-01-14

申请号：GB9500965

申请日：1995-01-18

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/14 ,  H01L23/31 ,  H01L23/12 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K7/20 ,  H05K1/18 ,  H05K3/34

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

公开(公告)号：HK1011499A1

公开(公告)日：1999-07-09

申请号：HK98112233

申请日：1998-11-24

Applicant: IBM

Inventor： ANDROS FRANK EDWARD ,  BUPP JAMES RUSSELL ,  DIPIETRO MICHAEL ,  HAMMER RICHARD BENJAMIN

IPC: H01L21/607 ,  H01L23/12 ,  H01L23/14 ,  H01L23/31 ,  H01L23/367 ,  H01L23/495 ,  H01L23/498 ,  H05K

Abstract: An electronic package which includes a rigid support member, e.g., copper sheet, to which is bonded both the package's semiconductor chip and circuitized substrate members. The chip is bonded using a thermally conductive adhesive while the circuitized substrate, preferably a flexible circuit, is bonded using an electrically insulative adhesive. The chip is electrically coupled to designated parts of the circuitry of the substrate, preferably by wire, thermocompression or thermosonic bonding. An encapsulant may be used to cover and protect the connections between the chip and substrate. This package may in turn be electrically coupled to a separate, second substrate such as a PCB.

公开(公告)号：DE3375588D1

公开(公告)日：1988-03-10

申请号：DE3375588

申请日：1983-07-04

Applicant: IBM

Inventor： BUPP JAMES RUSSELL ,  MARKOVICH VOYA ,  NAPP TRACY ELLEN ,  SAMBUCETTI CARLOS JUAN

IPC: H05K3/18 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/38

Abstract: A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and or on the surfaces of the substrate.