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公开(公告)号：DE1944416A1
公开(公告)日：1970-03-12
申请号：DE1944416
申请日：1969-09-02
Applicant: IBM
Inventor： PARKER KENNEDY DAVID , ANTHONY PERRI JOHN , RISEMAN JACOB
Abstract: 1,260,567. Semi-conductor devices. INTERNATIONAL BUSINESS MACHINES CORP. 13 Aug., 1969 [3 Sept., 1968], No. 40475/69. Heading H1K. A method of making a transistor comprises producing a layer 2 of semi-conductor material on an insulating substrate 1, masking the surface of the layer, providing an aperture in the mask to expose a portion of the surface, diffusing impurity of one kind into the exposed portion to form a first region of opposite conductivity type to the original layer separated from the original layer by a PN junction 4 extending right through the layer from its upper to its lower surface, then repeating the process with an impurity of the other kind to form a second region of the same conductivity type as the original layer within the first region and separated from it by a PN junction 5 extending right through the layer from its upper to its lower surface. The substrate may be sapphire, SiC, Si 3 N 4 or SiO 2 and the semiconductor material is silicon.
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公开(公告)号：DE1522119A1
公开(公告)日：1969-08-07
申请号：DE1522119
申请日：1966-12-14
Applicant: IBM
Inventor： EUGENE HARDING WILLIAM , ANTHONY PERRI JOHN , RISEMAN JACOB , SCOTT RUDER WINFIELD
Abstract: 1,156,840. Multiple image cameras. INTERNATIONAL BUSINESS MACHINES CORP. Jan. 13, 1967 [Jan. 14, 1966], No. 2054/67. Heading G2A. A multiple image camera comprises means 40 for supporting a pattern 48 to be projected a photographic plate 60 and an array of image forming elements positioned in a movable member, there being means for causing moving and movable member in two perpendicular directions parallel to the plate 60. The pattern 48 may be divided in to four sections and each individually photographed or four different templates may be successively placed over a single pattern as each photograph is taken. In the first case, the lens array 20 is indexed so that the optical axes are centered in turn in each quadrant of the squares surrounding the circles 26. Indexing is effected by air cylinders (70X + ) 70X - , 70Y + , (70Y -1 ) Fig. 3A (not shown), and probes 100X + , 100X - , 100Y + , 100Y - are provided to check the correct positioning of the lens array before an exposure is made. The electric curcuit described for operating the apparatus is semi-automatic in operation, but may be fully automatic. After the four exposures have been made the single photograph is developed and the negative is employed as a mask for use in manufacturing semiconductor devices. The lens array is also adjustable in a direction perpendicular to the pattern 48.
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公开(公告)号：DE1591186B1
公开(公告)日：1971-01-14
申请号：DE1591186
申请日：1967-03-03
Applicant: IBM
Inventor： AUGUSTUS CHANCE DUDLEY , SUNG-SOON IM SAMUEL , ANTHONY PERRI JOHN , RISEMAN JACOB
Abstract: 1,162,184. Semi-conductor devices; printed circuit assemblies. INTERNATIONAL BUSINESS MACHINES CORP. 9 March, 1967, No. 11043/67. Headings H1K and H1R. Monolithic or integrated semi-conductor devices are gold-coated on their lower surfaces and hot pressure bonded to superposed gold and chromium layers at the bottom of cavities in a substrate of glass or ceramic (e.g. 96% alumina). The cavities are formed by pressing the green ceramic or by bonding an apertured alumina sheet to an alumina blank. Each device has a plurality of built-up contacts extending through a protective glass coating on its upper surface and these lie in substantially the same plane as lands on the top surface of the substrate and which consist of aluminium, copper, or one or more noble metals. (For example the lands may have superposed gold, copper, and chromium layers). A plate is provided with conductive tracks suitably placed to interconnect adjacent contacts and lands. Suitable plates are aluminium or copper foils, paper, resin-reinforced fibrous materials, tetrafluoroethylene resins, polyethylene-terephthalate resins, and polyimide resins. The conductive tracks are formed on these, preferably on an intermediate acrylate resin parting layer, by laminating and etching, or by masked evaporation and may consist of aluminium, copper, or one or more noble metals. (A track may have superposed gold, lead, tin and copper layers). Preferably the plate is transparent so that visual alignment may be used in the bonding process, and is preferably insulating so that interconnection tests may be made before bonding. The backing may be clamped to the devices and substrate on a hot stage (which may have orienting pegs engaging the backing) and the assembly bonded by a solder reflow technique using lead-tin solder. Instead, single or multi-tipped thermocompression bonding machines may be used, the tips penetrating the backing during bonding. If ultrasonic bonding heads are used these are first heated to penetrate the backing and ultrasonic energy then supplied to affect the bonding. Laser or electron beam bonding may be used instead. The bonding layer is pulled away from the bonded contact tracks and lands, any parting layer being dissolved away. Alternatively the backing plate may be multilayered and consist of polyimide sheets bearing conductive tracks formed by masked evaporation or electrochemical deposition. Through-holes in the backing are metallized to provide interconnection between tracks in the various planes. Such a backing plate remains in place after bonding to interconnect the devices on the substrate.
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公开(公告)号：DE1923317A1
公开(公告)日：1969-11-20
申请号：DE1923317
申请日：1969-05-07
Applicant: IBM
Inventor： ANTHONY PERRI JOHN , RISEMAN JACOB
IPC: A63H18/08 , C23C14/00 , C23C16/00 , H01H11/04 , H01L21/00 , H01L21/24 , H01L21/28 , H01L21/283 , H01L21/285 , H01L7/46
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