公开(公告)号：DE1522119A1

公开(公告)日：1969-08-07

申请号：DE1522119

申请日：1966-12-14

Applicant: IBM

Inventor： EUGENE HARDING WILLIAM ,  ANTHONY PERRI JOHN ,  RISEMAN JACOB ,  SCOTT RUDER WINFIELD

IPC: G03B27/32 ,  G03B19/02 ,  G03F7/20 ,  H01L21/027 ,  H01L21/30 ,  G03B27/42

Abstract: 1,156,840. Multiple image cameras. INTERNATIONAL BUSINESS MACHINES CORP. Jan. 13, 1967 [Jan. 14, 1966], No. 2054/67. Heading G2A. A multiple image camera comprises means 40 for supporting a pattern 48 to be projected a photographic plate 60 and an array of image forming elements positioned in a movable member, there being means for causing moving and movable member in two perpendicular directions parallel to the plate 60. The pattern 48 may be divided in to four sections and each individually photographed or four different templates may be successively placed over a single pattern as each photograph is taken. In the first case, the lens array 20 is indexed so that the optical axes are centered in turn in each quadrant of the squares surrounding the circles 26. Indexing is effected by air cylinders (70X + ) 70X - , 70Y + , (70Y -1 ) Fig. 3A (not shown), and probes 100X + , 100X - , 100Y + , 100Y - are provided to check the correct positioning of the lens array before an exposure is made. The electric curcuit described for operating the apparatus is semi-automatic in operation, but may be fully automatic. After the four exposures have been made the single photograph is developed and the negative is employed as a mask for use in manufacturing semiconductor devices. The lens array is also adjustable in a direction perpendicular to the pattern 48.

公开(公告)号：DE1296265B

公开(公告)日：1969-05-29

申请号：DEJ0027385

申请日：1965-01-23

Applicant: IBM

Inventor： LEE LANGDON JACK ,  PHILIP PECORARO RAYMOND ,  EUGENE HARDING WILLIAM

IPC: H01L21/00 ,  H01L23/485

Abstract: 1,021,359. Connections to semi-conductors. INTERNATIONAL BUSINESS MACHINES CORPORATION. Jan. 15, 1965 [Jan. 27, 1964], No. 1798/65. Heading H1K. An electrical connection is made to part of the surface of a semi-conductor body having an insulating layer thereover, by forming on said layer a coating of readily solderable material, making an opening in the layer and the coating to expose part of the surface, depositing a metal to form an ohmic contact on said exposed surface and on the walls of the opening and to overlap a portion of said coating whilst leaving another portion unexposed. To make a device as shown in Fig. 10, wherein silicon body 1 has an oxide film 2 and an ohmic aluminium metal contact 11 with a readily solderable material 8, successive coating, photo-resist and etching steps are used (illustrated in detail, Figs. 1 to 9, not shown). The readily solderable material may be Cr or Mo having an upper layer of Ni or Ag whilst the ohmic contact may also be formed by Au, Pd or Pt but Al is preferred. Ge bodies may also be treated. The oxide layer 2 may have a glass layer interposed between it and the metal layer 8. The finished article may be encapsulated in glass.

公开(公告)号：DE1521625A1

公开(公告)日：1969-05-14

申请号：DE1521625

申请日：1964-07-01

Applicant: IBM

Inventor： EUGENE HARDING WILLIAM ,  S SCHWARTZ ROBERT

IPC: H01L21/288 ,  H01L21/304 ,  H01L21/316 ,  H01L21/56 ,  H01L21/68 ,  H01L21/78 ,  H01L23/29 ,  H01L23/31

Abstract: 1,006,174. Coating semi-conductor chips. INTERNATIONAL BUSINESS MACHINES CORPORATION. July 2, 1964 [July 3, 1963], No. 27309/64. Heading H1K. An insulating coating is produced on a semiconductor chip made from a semi-conductor blank by joining one side of the blank to a larger supporting surface so that a selected surface is masked, applying a masking overlay to the opposite side of the blank, dividing the blank into a plurality of separate masked chips each joined to the supporting surface and applying the insulating coating solely to the unmasked surfaces of the chips along the dividing line between the chips. In a specific embodiment, Fig. 4, an uncut semi-conductor blank is joined to a stainless steel or platinum cathode 36 by a silver epoxy adhesive 34, thus ensuring good electrical contact therewith. Next the upper surface of the blank is coated with a masking material 38, e.g. black wax. An ultrasonic cutter using an oil base abrasive grit is used to divide the blank into a plurality of chips. After washing, the chip-bearing cathode 36 is immersed in an electrophoretic bath 32, e.g. of finely divided glass dispersed in ethyl acetate or A1 or Mg oxide dispersed in water or methanol. A D.C. voltage is applied between cathode 36 and electrode 44 and an insulating coating is built up on the exposed surfaces. After removal of the chips 39 and cathode 36 from the bath, the masking material 38 is removed and then the adhesive 34. The glass coating may be hardened by firing it in air. The Specification discloses the modification of the coated chips by doping the lower surface thereof with material to give an oppossite conductivity type. This semi-conductor junction device is then soldered on to a printed circuit.

公开(公告)号：DE1464681A1

公开(公告)日：1969-01-30

申请号：DE1464681

申请日：1962-12-21

Applicant: IBM

Inventor： EUGENE HARDING WILLIAM

IPC: G03F7/20 ,  H01L21/00 ,  G03C5/00