公开(公告)号：JPH04337509A

公开(公告)日：1992-11-25

申请号：JP12312591

申请日：1991-04-26

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA HIROYOSHI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31

Abstract: PURPOSE: To embody high-density recording by a ferrite head by joining the bonding bumps of two chips, thereby forming a winding coil. CONSTITUTION: The chip 1 is formed with multilayered wirings 10 and the bonding bumps 13 on an Si substrate 12. The chip 2 is formed with the multilayered wirings 10 of copper, conducting paths 14 penetrating the substrate, the bonding bumps 13 and grooves 6 for crossing the ferrite cores. The bonding bumps 13 are composed of a low melting solder and are melted by a heat treatment at about 150 deg.C. The chips 1 and 2 are joined by melting the bonding bumps 13, by which the winding coil is formed.

公开(公告)号：CA2061118A1

公开(公告)日：1992-10-27

申请号：CA2061118

申请日：1992-02-12

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA KOHKI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31 ,  G11B5/193

Abstract: JA9-91-005 MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF In a magnetic head, including a magnetic core and a slider, a first chip having layered wires and bonding bumps is disposed inside a winding window; a second chip having layered wires, bonding bumps, and a groove straddling the magnetic core, is disposed outside of the winding window wherein the bonding bumps of both chips are bonded to each other so that a laminated wiring coil is formed.

公开(公告)号：BR9201350A

公开(公告)日：1992-12-01

申请号：BR9201350

申请日：1992-04-13

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA KOHKI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31

Abstract: In magnetic head including a magnetic core and a slider, a first chip having layered wires and bonding bumps is disposed inside of a winding window, and a second chip having layered wires, bonding bumps, and a groove straddling the magnetic core is disposed outside of the winding window, wherein the bonding bumps of both chips are bonded to each other so that a laminated wiring coil is formed.