公开(公告)号：BR9201350A

公开(公告)日：1992-12-01

申请号：BR9201350

申请日：1992-04-13

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA KOHKI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31

Abstract: In magnetic head including a magnetic core and a slider, a first chip having layered wires and bonding bumps is disposed inside of a winding window, and a second chip having layered wires, bonding bumps, and a groove straddling the magnetic core is disposed outside of the winding window, wherein the bonding bumps of both chips are bonded to each other so that a laminated wiring coil is formed.

公开(公告)号：CA2061118A1

公开(公告)日：1992-10-27

申请号：CA2061118

申请日：1992-02-12

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA KOHKI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31 ,  G11B5/193

Abstract: JA9-91-005 MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF In a magnetic head, including a magnetic core and a slider, a first chip having layered wires and bonding bumps is disposed inside a winding window; a second chip having layered wires, bonding bumps, and a groove straddling the magnetic core, is disposed outside of the winding window wherein the bonding bumps of both chips are bonded to each other so that a laminated wiring coil is formed.

公开(公告)号：JPH08124679A

公开(公告)日：1996-05-17

申请号：JP26039194

申请日：1994-10-25

Applicant: IBM JAPAN ,  AIMESU KK

Inventor： TAKEDA KAZUYA ,  MATSUMOTO TOSHIO ,  MIZUKAMI TOKIO ,  KUWABARA AKIO

IPC: H05B33/04 ,  H01L51/50 ,  H01L51/52 ,  H05B33/12 ,  H05B33/26

Abstract: PURPOSE: To provide an electroluminescent device excellent in environment resisting characteristic in which the deterioration of emission due to Joule's heat is improved. CONSTITUTION: An electron injecting cathode layer 503 is formed adjacent to a metal thin film 502 formed on a glass substrate 501, an electroluminescent emitting layer 504 and a hole injecting anode layer 506 are formed on the electron injecting cathode layer, and the outside surface of the laminated body consisting of the electron injecting cathode layer, the electroluminescent emitting layer and the hole injecting anode layer is sealed by a light transmitting protective film 508. The substrate consists of a metal base or flexible organic material base having an insulating layer on the surface or glass base. The metal thin film consists of a conductive metal reflecting light. The material of the electron injecting cathode layer consists of one material selected from the group consisting of calcium, lithium and magnesium. The thickness of the material is 100Å to 500Å. The material of the light emitting layer consists of tris-(8- hydroxyquinolino) aluminium.

公开(公告)号：JPH08102158A

公开(公告)日：1996-04-16

申请号：JP22211694

申请日：1994-09-16

Applicant: IBM

Inventor： HARADA YOSHINAO ,  SONOBE YOSHIAKI ,  TOKUMITSU HAJIME ,  TAKEDA KAZUYA ,  IWASAKI KEIICHI

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21

Abstract: PURPOSE: To reduce the thickness while decreasing the cost and eliminating the danger of contact of wirings with a disk. CONSTITUTION: A metal thin plate 12 of the material for forming load beams 106, 107 integrates carriages 104, 105 connected from flexures 116, 117, VCM coils 102, 103 and the support plate 180 of a flexible board 100. Signal output lines 108 to 115 from magnetic heads 150, 150 and signal line 185 from the coils 102, 103 are directly integrally connected to the board 100 without solder connecting.

公开(公告)号：JPH04337509A

公开(公告)日：1992-11-25

申请号：JP12312591

申请日：1991-04-26

Applicant: IBM

Inventor： ARAI YUICHI ,  KOBAYASHI SAKAE ,  NODA HIROYOSHI ,  TAKEDA KAZUYA ,  UMEZAKI HIROSHI

IPC: G11B5/127 ,  G11B5/105 ,  G11B5/17 ,  G11B5/31

Abstract: PURPOSE: To embody high-density recording by a ferrite head by joining the bonding bumps of two chips, thereby forming a winding coil. CONSTITUTION: The chip 1 is formed with multilayered wirings 10 and the bonding bumps 13 on an Si substrate 12. The chip 2 is formed with the multilayered wirings 10 of copper, conducting paths 14 penetrating the substrate, the bonding bumps 13 and grooves 6 for crossing the ferrite cores. The bonding bumps 13 are composed of a low melting solder and are melted by a heat treatment at about 150 deg.C. The chips 1 and 2 are joined by melting the bonding bumps 13, by which the winding coil is formed.