公开(公告)号：JPH0655260A

公开(公告)日：1994-03-01

申请号：JP8164393

申请日：1993-04-08

Applicant: IBM

Inventor： TOOMASU JIYOOJI FUERENSU ,  PIITAA ARUFURETSUDO GURABAA ,  BAANAADO HERUNANDESU ,  MAIKERU JIYON PAAMAA ,  AASAA RICHIYAADO JINGAA

IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34

Abstract: PURPOSE: To provide a device and a method enabling formation of a solder mount of uniform height by injection molding solder on an electronic device. CONSTITUTION: A device 2 has a reservoir pipe for molten solder arranged on a cavity of an injection plate 34. The injection plate is arranged on a forming mold 32, having an array of cavities. The forming mold is arranged on a working member. The working member is heated, and molten solder is pushed by gas pressure into a recessed part of the injection plate arranged on the array of cavities of mold and then into the array of cavities of forming mold. The injection plate slides on the forming mold and wipes away excess solder on the forming mold with a plurality of wiping apertures. The injection plate further moves to the position of a non-solder affinitive surface and is removed there.