公开(公告)号：JPH06104374A

公开(公告)日：1994-04-15

申请号：JP24732291

申请日：1991-09-26

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  ISUMAIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H01L23/50 ,  H01L21/48 ,  H05K3/34 ,  H05K13/00

Abstract: PURPOSE: To provide an electronic circuit packaging interface adaptable to high conductor density, which connects a plurality of conductors and a plurality of contact parts formed on the surface of a substrate, wherein the conductors are provided in rows on a conductor carrier at narrow intervals. CONSTITUTION: Conductors 6 and 7 extending from an edge 9 of a carrier 5 in a cantilever fashion are connected to contact parts 3 and 4. The conductors neighboring each other are connected to the contact parts, which are formed at positions having different distances 10 and 11 from the carrier. Each conductor is extended on a supporting surface to the vicinity of the contact part to which the conductor is connected, bent at the vicinity and extended towards a substrate 2 at a generally vertical angle. Further, the conductor is bent near the contact part, and the tip of the conductor is horizontally extended along the contact part.

公开(公告)号：JPH0685096A

公开(公告)日：1994-03-25

申请号：JP16049093

申请日：1993-06-30

Applicant: IBM

Inventor： REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA ,  UIRIAMU EDOWAADO PENSU FUOOSU

IPC: H01L23/06 ,  H01L23/14 ,  H01L23/367 ,  H01L23/373 ,  H05K5/00 ,  H05K5/02 ,  H05K7/20

Abstract: PURPOSE: To obtain a packaging structure, which is superior in points of shock resistance, electric shielding effect, convection cooling and heat transfer, by a method wherein a high-density lightweight electronic packaging device with a convection cooling function is constituted into a structure, wherein the device is encircled with a cover comprising a permeable material. CONSTITUTION: A packaging material 1, which enables the passing of the air in all directions, has a wide-ranging heat transfer power, a structural holding power and an electrical conductivity and is formed into a spongy structure which is of use as an electric shield, is prepared. In the case where this material 1 is used for a package of a component for signal processing use of an electronic device, an electronic component holding material (insulating thin film) 2 is arranged on the surface of the material 1 and a printed wiring or the like, for example, is provided on the holding material 2 as the component 4 for signal processing use. Some open parts 3 are formed in the insulating thin film 2 to allow to flow the air in the material 1. As a result, the material results in being able to be cooled all the material 1 over.

公开(公告)号：JPH02285832A

公开(公告)日：1990-11-26

申请号：JP6851490

申请日：1990-03-20

Applicant: IBM

Inventor： ADORIAN CHIYAARUZU FUREDERITSU ,  KURISUTOFUAA NOOMAN WAARISU ,  FUIRITSUPU JIYON MAAFUETSUTO ,  SUTEIBUN FUAANISU ,  TOOMASU UINROO ,  MAIKERU JIYON PAAMAA

IPC: H04L7/10 ,  G06F5/08 ,  H03M9/00 ,  H04L7/00 ,  H04L7/033 ,  H04L7/04 ,  H04L25/06 ,  H04L25/38

Abstract: PURPOSE: To prevent information from being lost by recognizing a sample pattern through a decoder and activating the read of the final sample in the next term from the first sample in a term determined by a receiver concerning the sample of which this pattern is read. CONSTITUTION: The samples read from a data stream at suitable intervals are sent to 5 pieces of double-step shift registers 54. The latest sample is stored in a step 56 and the oldest sample is stored in a step 58. The respective samples are separated in the 1/5 term of a data bit term. Since the pattern is recognized by logic elements 60, 62, 64, 66 and 68 composed of six wide AND gates having transducers at three position of an input part, the transition from Low to High is detected. By recognizing the pattern, phase information is applied and corresponding to this information, the sample of an object to be read can be seletected.

公开(公告)号：JPH0241772A

公开(公告)日：1990-02-09

申请号：JP15597789

申请日：1989-06-20

Applicant: IBM

Inventor： HARII RANDERU BITSUKUFUOODO ,  REIMONDO ROBAATO HOOTON ,  IZUMEIRU SEBUDETO NOOAN ,  MAIKERU JIYON PAAMAA ,  JIYOON CHIYAARUZU JIIZU

IPC: B23K1/012 ,  H01L21/00 ,  H01L21/60 ,  H05K3/34

Abstract: PURPOSE: To achieve the fluxless soldering using no silane by directing the gas having the prescribed momentum sufficient to wet the solder wettable surface with the molten solder of the prescribed temperature and not oxidized toward a mound to cool the molten solder. CONSTITUTION: A solder mound 2 is brought into contact with a surface 8 of an object 4 and a surface 10 of an object 6, and the surfaces 8, 10 are solder- wettable. The gas flow 12 is directed to a heater 14, and the heated gas flow 22 is at the high temperature sufficient to melt the solder mound 2. When the mound 2 is melted, oxides on a solid solder are afloat on the surface of the molten solder, the gas flow 22 is directed to the molten solder, and their momentum breaks the surface oxide in the non-oxidized solder and homogenizes the surface oxide when collided with the afloat oxide. The non-oxidized molten solder is brought into contact with the wettable surfaces 8, 10, and the part is then cooled, and the objects 4, 6 are joined with a solder part 24.

公开(公告)号：JPH05218608A

公开(公告)日：1993-08-27

申请号：JP21676992

申请日：1992-08-14

Applicant: IBM

Inventor： KURAUDEIUSU FUIIGAA ,  TERESHITA OODOONZU GURAHAMU ,  KAATO RUDORUFU GURIIBU ,  ARUFUONSO FUIRITSUPU RANZETSUT ,  JIYON JIYOZEFU RIUTOKASU ,  RINDA KIYARORAIN MASHIYUU ,  MAIKERU JIYON PAAMAA ,  NERUSON RATSUSERU TANAA ,  HOO MIN TON ,  CHIYAARUZU HAIRE UIRUSON ,  HEREN RI IEE

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01R12/04 ,  H05K1/11 ,  H05K3/00 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36

Abstract: PURPOSE: To provide a method for obtaining a self-aligned protecting coating, so as to cover a gold-plated copper wire in a flex manufacturing process. CONSTITUTION: This method has following steps, wherein a gold layer 14 is plated on a copper lead 13 that is selectively fixed to a polyimide substrate through a seed layer 13A made of e.g. chromium. Thereafter a resist is used on both side first. Then, the resist is exposed on the both sides of the substrate and developed, and a polyimide 15 is etched. Then, a window 16 is formed. After the window has been formed, the resist is further exposed and hardened.

公开(公告)号：JPH0216762A

公开(公告)日：1990-01-19

申请号：JP9657289

申请日：1989-04-18

Applicant: IBM

Inventor： HARII RANDERU BITSUKUFUOODO ,  MAAKU FUIIRUDEINGU BUREEGUMAN ,  POORU ANDORIYU MOSUKOUTSUTSU ,  MAIKERU JIYON PAAMAA ,  TEIMOSHII KURAAKU RERAA ,  PEIJI ADAMUSU POO ,  KIYARORIN AN KOBUAKU

IPC: H01L25/18 ,  H01L23/495 ,  H01L25/065 ,  H01L25/07

Abstract: PURPOSE: To increase the mounting density of a semiconductor chip by connecting the conductive patterns of two electronic devices which are oppositely arranged by means of laying the inner end of a beam lead without solder. CONSTITUTION: A substrate 4 has a face 14 and a substrate 6 has a face 12. The respective faces have respective terminals 16 and 18 and pads 20 and 22 which are electrically connected to the respective faces are formed. Solder mounds 24 and 26 are arranged on the pads 20 and 22. The active face 8 of the substrate 4 is held by making it face the active face 10 of the substrate 6, and the pattern of the solder mound on the face 8 is positioned with the pattern of the solder mound on the face 10. The inner lead bond(ILB) end 32 of the beam lead 28 is positioned between the mounds 24 and 26. Then, substrate assembly is put in a reflow furnace and it is heated to a temperature that the solder mounds 24 and 26 are melted. When solder is solidified, the two substrates are electrically connected, the beam lead is soldered and it protrudes outside from a space between the two substrates.

公开(公告)号：JPH0655260A

公开(公告)日：1994-03-01

申请号：JP8164393

申请日：1993-04-08

Applicant: IBM

Inventor： TOOMASU JIYOOJI FUERENSU ,  PIITAA ARUFURETSUDO GURABAA ,  BAANAADO HERUNANDESU ,  MAIKERU JIYON PAAMAA ,  AASAA RICHIYAADO JINGAA

IPC: B23K3/00 ,  B23K1/20 ,  B23K3/06 ,  B29C45/00 ,  H05K3/34

Abstract: PURPOSE: To provide a device and a method enabling formation of a solder mount of uniform height by injection molding solder on an electronic device. CONSTITUTION: A device 2 has a reservoir pipe for molten solder arranged on a cavity of an injection plate 34. The injection plate is arranged on a forming mold 32, having an array of cavities. The forming mold is arranged on a working member. The working member is heated, and molten solder is pushed by gas pressure into a recessed part of the injection plate arranged on the array of cavities of mold and then into the array of cavities of forming mold. The injection plate slides on the forming mold and wipes away excess solder on the forming mold with a plurality of wiping apertures. The injection plate further moves to the position of a non-solder affinitive surface and is removed there.

公开(公告)号：JPH04356937A

公开(公告)日：1992-12-10

申请号：JP3667091

申请日：1991-02-07

Applicant: IBM

Inventor： UIRIAMU DEIIN BURUUA ,  KURUTO RUDORUFU GUREEBE ,  REIMONDO ROBAATO HOOTON ,  RINDA KARORIN MASHIYUU ,  IZUMEERU SEBUDETO NOIYAN ,  MAIKERU JIYON PAAMAA ,  SANPASU PURUSHIYOTAMAN ,  DEBITSUDO RII RASU

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

Abstract: PURPOSE: To provide a composition and coating for preventing the generation of electrolytic migration between tape automated bonding(TAB) package leads. CONSTITUTION: A nickel alloy protection coating 15 is applied to an alloy composition or a copper-made current carrying lead 13 containing copper/nickel. Consequently the formation of a dendrite between TAB package leads can be prevented.

公开(公告)号：JPH03296241A

公开(公告)日：1991-12-26

申请号：JP40861690

申请日：1990-12-28

Applicant: IBM

Inventor： BAANAADO HAANANDESU ,  REIMONDO ROBAATO HOOTON ,  ISUMEIRU SEBUDETO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H01L21/60 ,  B23K20/02 ,  F28F9/20 ,  F28F13/00

Abstract: PURPOSE: To provide a heat-insulating insertion device of high efficiency and low mass by filling the space of two hollow disc members fixed each other with a bonding member, having heat insulating property with plural small thermal conductive particles. CONSTITUTION: A heat shield 150 comprises two hollow disc members 160 and 161, fixed each other with bonding members 162 and 163 having heat insulating property. In the hollow region between disc members 160 and 161, for example, balls 185 of stainless steel are packed. In addition, an air distributor 169 is built in the heat shield 150, and low-temperature air is blown from a cooling air tube 135 into between balls. During operation, flow-out heat from an HAT device 100 heats the bottom part disc member 160, and its heat is transferred to the ball 185. Further, the heat is transferred from the ball 185 to a cooling gas.

公开(公告)号：JPH03173199A

公开(公告)日：1991-07-26

申请号：JP28411490

申请日：1990-10-22

Applicant: IBM

Inventor： MAAKU FUIIRUDEINGU BURETSUGUMA ,  REIMONDO ROBAATO HOOTON ,  ISUMEIRU SEBUDETSUTO NOYAN ,  MAIKERU JIYON PAAMAA

IPC: H05K7/20 ,  H01L23/538 ,  H01L25/00 ,  H01L25/065

Abstract: PURPOSE: To obtain a three-dimensional chip package in which mounting density and cooling efficiency are enhanced by bonding a plurality of semiconductor substrates physically, at a part of each thereof, to form an enclosure and passing cooling fluid through the enclosure. CONSTITUTION: Chips 150, 151 are arranged at predetermined indications on chip carriers 101-107. For example, the chips 150, 151 are fixed to one side of the carrier 101 and no chip is mounted on the face A of the carrier 106 and the face B of the carrier 107. A channel 190 is formed between the carriers 104, 105 and a channel 191 formed between the carriers 106, 107. An interconnection of signal and power provided between the carriers can realize high band signal transmission between a processor device and a memory device through connecting parts 135, 136. In order to cool an assembly 100 efficiently, coolant is introduced to the channels 190, 191 and flow-out of liquid or gas coolant from the cooling channel is prevented by means of hermetic seals 175, 176.