公开(公告)号：JP2002353729A

公开(公告)日：2002-12-06

申请号：JP2002101234

申请日：2002-04-03

Applicant: IBM

Inventor： BALLANTINE ARNE WATSON ,  EDELSTEIN DANIEL CHARLES ,  NAKOS JAMES SPIROS ,  STAMPER ANTHONY KENDALL

IPC: H01Q21/28 ,  H01P11/00 ,  H01Q1/22 ,  H01Q1/38 ,  H01Q13/02 ,  H01Q13/06

Abstract: PROBLEM TO BE SOLVED: To provide a method for fabricating a horn antenna device within an integrated circuit chip. SOLUTION: The horn antenna device 100 includes a metallic horn structure 10 with a wide aperture, that is, a horizontal waveguide. The horizontal waveguide has a tapered via that electromagnetically communicates with a vertical waveguide structure 60 to transmit energy to and from an electronic sub-component 40 configuring part of IC chips 5. Dual damascene processing is used to fabricate the horn antenna device within the IC chip.