公开(公告)号：DE3672282D1

公开(公告)日：1990-08-02

申请号：DE3672282

申请日：1986-12-23

Applicant: IBM

Inventor： BLACKWELL KIM JOSEPH ,  WHITE JR

IPC: H01L21/285 ,  C23C14/06 ,  C23C14/14 ,  C23C14/22 ,  C23C14/34 ,  C23C14/35 ,  H01J37/34 ,  C23C14/24 ,  C23C14/28

公开(公告)号：DE3575952D1

公开(公告)日：1990-03-15

申请号：DE3575952

申请日：1985-02-22

Applicant: IBM

Inventor： BLACKWELL KIM JOSEPH ,  WHITE JR ,  WILSON JAMES WARREN

IPC: C23C14/34 ,  C23C14/04 ,  C23C14/22 ,  C23C14/35 ,  H01J37/34 ,  H01L21/203 ,  H01L21/285 ,  H05K3/40 ,  C23C14/24 ,  H05K3/18

Abstract: A system for vacuum depositing a material onto a sample (12) having a surface recess, such as a hole or channel, therein. The system includes a vacuum chamber capable of attaining a high vacuum and a vacuum deposition source (134) in the chamber for emitting atoms. An energy source (130) is connected to the vacuum deposition source (134) to initiate emission of the atoms therefrom. A sample (12) having an upper surface disposed in the vacuum chamber opposite the vacuum deposition source (134) is adapted to receive the atoms emitted from the vacuum deposition source (134). The ' sample (12) has surface recesses (14-20) therein with walls (22) substantially perpendicular to the plane of the sample (12). Finally, a component (146, 148) for eliminating undesirable depositing angles of atoms is disposed intermediate the vacuum deposition source (134) and the sample (12) in order t to improve the ratio of recess wall to sample surface deposition. Another important feature of the component for eliminating undesirable depositing angles is its ability to reduce heat generated on the sample (12) during the deposition process.