公开(公告)号：JP2000101012A

公开(公告)日：2000-04-07

申请号：JP21489799

申请日：1999-07-29

Applicant: IBM

Inventor： BLASI CHARLES J ,  DAS GOBINDA ,  MOTIKA FRANCO

IPC: H01L23/12 ,  G01R1/067 ,  H01L23/50 ,  H01L23/64 ,  H01L25/00 ,  H01L25/16 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide a reformed-type structure which raises the effect of a decoupling capacitor by reducing the influence of the inductance concerned with the decoupling capacitor. SOLUTION: A multilayer ceramic module includes a multilayer ceramic substrate 20 having upside and downside, at least one semiconductor chip 25 attached to the upside of the substrate, a plurality of module pins 23 projected from the downside of the substrate, and at least one decoupling capacitor 21 attached to the substrate between adjacent module pins under the substrate.