公开(公告)号：DE69220333D1

公开(公告)日：1997-07-17

申请号：DE69220333

申请日：1992-10-19

Applicant: IBM

Inventor： BONITZ BARRY ALAN ,  ELLERSON JAMES VERNON ,  KAPUR KISHEN NARAIN ,  MCCREARY JACK MARLYN ,  MEMIS IRVING ,  VETTEL GERALD MICHAEL

IPC: H01L23/50 ,  H01L23/04 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K13/00 ,  H01L21/00

Abstract: An electronic package assembly (10) wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (11) (e.g., printed circuit board), the projecting conductive leads (21) of the package and the solder (53) which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (61) (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.