公开(公告)号：DE69220333D1

公开(公告)日：1997-07-17

申请号：DE69220333

申请日：1992-10-19

Applicant: IBM

Inventor： BONITZ BARRY ALAN ,  ELLERSON JAMES VERNON ,  KAPUR KISHEN NARAIN ,  MCCREARY JACK MARLYN ,  MEMIS IRVING ,  VETTEL GERALD MICHAEL

IPC: H01L23/50 ,  H01L23/04 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K13/00 ,  H01L21/00

Abstract: An electronic package assembly (10) wherein a low profile package is soldered to an organic (e.g., epoxy resin) substrate (11) (e.g., printed circuit board), the projecting conductive leads (21) of the package and the solder (53) which substantially covers these leads (and respective conductors on the substrate) having been substantially covered with encapsulant material (61) (e.g., polymer resin) to provide reinforcement for the solder-lead connections. The encapsulant material is dispensed about the solder and lead joints following solder reflow and solidification so as to substantially surround the solder and any portions of the leads not covered with solder. The invention has particular useful with thin, small outline package (TSOP) structures which occupy a minimum of height on the substrate surface.

公开(公告)号：MY116476A

公开(公告)日：2004-02-28

申请号：MYPI9400747

申请日：1994-03-28

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  MCCREARY JACK MARLYN ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT JR

IPC: B05C5/00 ,  B08B3/02 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

Abstract: A FLUID TREATMENT APPARATUS AND METHOD FOR APPLYING FIRST AND SECOND FLUIDS (E.G., ETCHANT AND WATER) TO AN ARTICLE (E.G., CIRCUIT BOARD) PASSING THROUGH THE APPARATUS AT A PREDETERMINED RATE. THE FIRST FLUID IS IMPINGED ON A SURFACE OF THE ARTICLE AND THEREAFTER COLLECTED WITHIN THE APPARATUS' COMMON HOUSING. THE SECOND FLUID IS IMPINGED ONTO THE SURFACE OF THE ARTICLE AND COLLECTED WITHIN THE SAME HOUSING BUT AT A LOCATION SEPARATE FROM THE COLLECTED FIRST FLUID SO AS TO AT LEAST PARTIALLY PREVENT MIXING THEREOF. THE PREFERRED MEANS FOR EFFECTING FLUID IMPINGEMENT COMPRISES SEPARATE FLUID INJECTORS, EACH INCLUDING AT LEAST TWO ROWS OF FLUID JET INJECTORS THEREIN. THE COLLECTED FLUIDS ARE EACH RETURNED TO THE RESPECTIVE IMPINGEMENT MEANS. REPLENISHMENT OF THE SECOND FLUID IS ACCOMPLISHED USING A PUMP WHICH SUPPLIES THE SECOND FLUID, WHILE THE APPARATUS ALSO INCLUDES MEANS (E. G. , A DRAIN) TO EFFECTIVELY REMOVE THE SECOND FLUID AT A RATE SIMILAR TO THE SUPPLY RATE FOR THE SECOND FLUID. THE FIRST FLUID IS ALSO MAINTAINED AT AN ESTABLISHED LEVEL ABOVE THE ARTICLE'S SURFACE USING SUITABLE MEANS (E.G., DUAL ROLLERS) LOCATED RELATIVE (E.G., ON OPPOSITE SIDES OF) THE FIRST FLUID IMPINGEMENT MEANS. SIMILAR LEVEL RETENTION FOR THE SECOND FLUID IS ALSO POSSIBLE. CASCADING OF THE COLLECTED SECOND FLUID IS ALSO DEFINED, THIS OCCURING WITHIN THE SAME HOUSING CHAMBER WHICH SERVES TO COLLECT THE FIRST FLUID.( FIG 1 )

公开(公告)号：DE69408490T2

公开(公告)日：1998-09-24

申请号：DE69408490

申请日：1994-03-30

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT ,  MCCREARY JACK MARLYN

IPC: B05C5/00 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.

公开(公告)号：DE69408490D1

公开(公告)日：1998-03-19

申请号：DE69408490

申请日：1994-03-30

Applicant: IBM

Inventor： BARD STEVEN LINDZ ,  BENDZ GERALD ANDREI ,  CANESTARO MICHAEL JAMES ,  CHAPURA JOHN ROBERT ,  FRANKOSKI EDWARD JAY ,  HORAN MICHAEL SHAWN ,  JONES JEFFREY DONALD ,  KAMPERMAN JAMES STEVEN ,  KJELGAARD JOHN ROBERT ,  MCCREARY JACK MARLYN

IPC: B05C5/00 ,  B05B15/04 ,  C23F1/08 ,  H01L23/12 ,  H05K3/00 ,  H05K3/06 ,  H05K3/18

Abstract: A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid.