公开(公告)号：JP2002009433A

公开(公告)日：2002-01-11

申请号：JP2001130649

申请日：2001-04-27

Applicant: IBM

Inventor： INTERRANTE MARIO J ,  BRENDA PETERSON ,  SDIPTA K RAY ,  WILLIAM E SABURINSKI ,  AMITT K SHAAKUHERU

IPC: B23K35/26 ,  C22C9/02 ,  C22C9/05 ,  C22C13/00 ,  C22C13/02 ,  H01L23/12 ,  H01L23/488 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a new semiconductor chip carrier connection which has a chip carrier and a 2nd level assembly formed by a surface amount technology. SOLUTION: The surface mount technology for a ball grid array(BGA), a column grid array(CGA), etc., is adopted and basically includes a non-solder metal connection such as a copper connection. This invention is concerned with a column grid array structure and its process.

公开(公告)号：SG91918A1

公开(公告)日：2002-10-15

申请号：SG200102375

申请日：2001-04-26

Applicant: IBM

Inventor： MARIO J INTERRANTE ,  BRENDA PETERSON ,  SUDIPTA KUMAR RAY ,  WILLIAM EDWARD SABLINSKI ,  AMIT K SARKHEL

IPC: B23K35/26 ,  C22C9/02 ,  C22C9/05 ,  C22C13/00 ,  C22C13/02 ,  H01L23/12 ,  H01L23/488 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40 ,  H01L21/60

Abstract: The present invention relates generally to a new semiconductor chip carrier connections, where the chip carrier and the second level assembly are made by a surface mount technology. More particularly, the invention encompasses surface mount technologies, such as, Ball Grid Array (BGA), Column Grid Array (CGA), to name a few, where the surface mount technology comprises essentially of a non-solder metallic connection, such as, a copper connection. The present invention is also related to Column Grid Array structures and process thereof.