公开(公告)号：JP2002009433A

公开(公告)日：2002-01-11

申请号：JP2001130649

申请日：2001-04-27

Applicant: IBM

Inventor： INTERRANTE MARIO J ,  BRENDA PETERSON ,  SDIPTA K RAY ,  WILLIAM E SABURINSKI ,  AMITT K SHAAKUHERU

IPC: B23K35/26 ,  C22C9/02 ,  C22C9/05 ,  C22C13/00 ,  C22C13/02 ,  H01L23/12 ,  H01L23/488 ,  H01L23/498 ,  H05K3/34 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a new semiconductor chip carrier connection which has a chip carrier and a 2nd level assembly formed by a surface amount technology. SOLUTION: The surface mount technology for a ball grid array(BGA), a column grid array(CGA), etc., is adopted and basically includes a non-solder metal connection such as a copper connection. This invention is concerned with a column grid array structure and its process.

公开(公告)号：JPH11274380A

公开(公告)日：1999-10-08

申请号：JP1653899

申请日：1999-01-26

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレイション

Inventor： FAROOQ SHAJI ,  MARIO J INTARANTE ,  SDIPTA K RAY ,  WILLIAM E SABURINSKI

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/498 ,  H05K3/34

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/0272 ,  H05K2201/094 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49126 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To make a bonding part sufficiently strong, and prevent structural completeness from being lost in the subsequent reflow process, by making the melting point of a second solder bond at one edge of a connector lower than that at the other edge. SOLUTION: In an assembled interconnecting structure with a completed column grid array, an interconnecting structure (column) composed of an element with other shape such as a spherical shape is connected to an electronic module board 4 and a circuit card 10 via a land 17. The other edge of the column is connected to the land 17 of the circuit card 10, by the use of a Pb/Sn eutectic solder 17 (second solder bond), which has a lower melting point than that of a transient melting solder bonding part 3. The melting point of the eutectic solder 18 is normally 200 deg.C or below. The connection is achieved by the transient melting solder bonding part 3, which contains fine metal powder additive and is used for mounting the column on an input/output pad 5 on the board 4.

Abstract translation: 要解决的问题：通过使连接器的一个边缘处的第二焊接点的熔点低于另一个边缘的熔点，使接合部分足够强，并且防止结构完整性在随后的回流工艺中丢失。 解决方案：在具有完整的列格栅阵列的组装的互连结构中，由具有诸如球形的其他形状的元件组成的互连结构（列）经由焊盘17连接到电子模块板4和电路卡10。 该列的另一个边缘通过使用具有比瞬时熔融焊接部分的熔点低的熔点的Pb / Sn共晶焊料17（第二焊料接合）连接到电路卡10的焊盘17上 共晶焊料18的熔点通常为200℃以下。 该连接是通过瞬态熔融焊接部3实现的，该焊接接合部3含有细金属粉末添加剂，并用于将该列安装在板4上的输入/输出焊盘5上。