公开(公告)号：DE3870378D1

公开(公告)日：1992-05-27

申请号：DE3870378

申请日：1988-08-02

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  BUI VU QUANG ,  HOFFARTH JOSEPH GERARD ,  WELSH JOHN ANDREW

IPC: B29C65/48 ,  B32B15/08 ,  C08J5/12 ,  C09J5/02 ,  C23C8/36 ,  H05K3/38 ,  H05K3/46 ,  C23F4/00

Abstract: A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.