公开(公告)号：DE3371798D1

公开(公告)日：1987-07-02

申请号：DE3371798

申请日：1983-06-23

Applicant: IBM

Inventor： CANESTARO MICHAEL JAMES ,  MCBRIDE DONALD GENE ,  WELSH JOHN ANDREW

IPC: C23C18/18 ,  C23C18/16 ,  C23C18/38 ,  C23C18/42 ,  C25D5/02 ,  G03F7/11 ,  H01L21/70 ,  H05K3/10 ,  H05K3/24 ,  H05K3/38 ,  H01L27/01 ,  G03F7/02

Abstract: A method of decreasing plated metal defects by applying a layer of a noble metal such as palladium, platinum, gold, iridium, rhodium, or mixtures thereof between a photoresist and a metallic surface.

公开(公告)号：DE3667895D1

公开(公告)日：1990-02-01

申请号：DE3667895

申请日：1986-01-07

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  HORWATH RONALD STEPHEN ,  LU NENG-HSING ,  WELSH JOHN ANDREW

IPC: C23F4/00 ,  H01J37/32 ,  H01L21/302 ,  H01L21/3065 ,  H05H1/46 ,  H05K3/00 ,  C23C14/40 ,  C23C16/50

Abstract: A system for generating a substantially uniform plasma for processing a substrate (32) having two major surfaces, each with electrically conductive portions. Two electrodes (28,30) are oppositely disposed with respect to one another on either side of the substrate. A first r.f. power source (34) is electrically connected to the first electrode (28) and a second r.f. power source (36) is electrically connected to the second electrode (30). The first and second r.f. power sources are out of phase with respect to one another, resulting in the generation of a substantially uniform plasma field.

公开(公告)号：DE3681077D1

公开(公告)日：1991-10-02

申请号：DE3681077

申请日：1986-05-28

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  HOFFARTH JOSEPH GERARD ,  WELSH JOHN ANDREW

IPC: B28B11/12 ,  B23B35/00 ,  H05K3/00 ,  H05K3/26 ,  H05K13/00

Abstract: The method for cleaning the cuts (24) machined into a workpiece (22) such as a printed electric circuit board, includes the steps of coating the cutting instrument (36) such as a drill bit, with a liquid tracer prior to the cutting operation. During the cutting operation, the liquid tracer becomes mixed with material such as an electrically insulating binder layer (50) disposed, e.g. between opposed metal plates (46, 48) of the workpiece (22). Any smear (52) of the insulating layer (50) upon exposed metal surfaces of the cut (24) contains elements of chemical compounds used in the tracer. After extraction of the cutting instrument (36) from the workpiece (22), the latter is placed in a plasma reactor (26) wherein the metal surfaces are etched to remove any smears and debris (52) of the insulation material found on the exposed metal surfaces. The tracer elements, such as deuterium and phosphorus are monitored in the effluent plasma of the reactor (26) to determine when the cleaning of the cuts (24) in the workpiece (22) is completed.

公开(公告)号：DE3870378D1

公开(公告)日：1992-05-27

申请号：DE3870378

申请日：1988-08-02

Applicant: IBM

Inventor： BABU SURYADEVARA VIJAYAKUMAR ,  BUI VU QUANG ,  HOFFARTH JOSEPH GERARD ,  WELSH JOHN ANDREW

IPC: B29C65/48 ,  B32B15/08 ,  C08J5/12 ,  C09J5/02 ,  C23C8/36 ,  H05K3/38 ,  H05K3/46 ,  C23F4/00

Abstract: A method for improving the adhesion of a polymer such as an epoxy resin to an electrolytic copper surface wherein the copper surface to be adhered is exposed to gas plasma containing a fluorohydrocarbon.