公开(公告)号：CA2011709C

公开(公告)日：1993-12-21

申请号：CA2011709

申请日：1990-03-07

Applicant: IBM

Inventor： CARR JEFFREY W ,  DAVID LAWRENCE D ,  GUTHRIE WILLIAM L ,  KAUFMAN FRANK B ,  PATRICK WILLIAM J ,  RODBELL KENNETH P

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/48 ,  C23F1/44 ,  H01L21/302

Abstract: Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps; obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; and contacting the substrate with a polishing pad while contacting the substrate with a slurry containing the etchant wherein the slurry includes abrasive particles, a transition metal chelated salt and a solvent for the salt. The chem-mech polishing causes the at least two features to be substantially coplanar. Also disclosed is the chem-mech polishing slurry.