2.
    发明专利
    未知

    公开(公告)号:DE3687409T2

    公开(公告)日:1993-07-15

    申请号:DE3687409

    申请日:1986-10-21

    Applicant: IBM

    Abstract: The present invention discloses a method of forming fine conductive lines, patterns, and connectors, in particular for electronic devices. The method comprises a series of steps in which: a polymeric material is applied to a substrate; the polymeric mate­rial is patterned to form openings through, spaces within, or combinations thereof in the polymeric material; subsequently, conductive material is applied to the patterned polymeric mate­rial, so that it at least fills the openings and spaces existing in the polymeric material; and excess conductive material is removed from the exterior major surface of the polymeric material using chemical-mechanical polishing, to expose at least the exterior major surface of the polymeric material. The structure remaining has a planar exterior surface, wherein the conductive material filling the openings and spaces in the patterned polymeric mate­rial becomes features such as fine lines, patterns, and connectors which are surrounded by the polymeric material. The polymeric material may be left in place as an insulator or removed, leaving the conductive features on the substrate.

    6.
    发明专利
    未知

    公开(公告)号:DE3687409D1

    公开(公告)日:1993-02-11

    申请号:DE3687409

    申请日:1986-10-21

    Applicant: IBM

    Abstract: The present invention discloses a method of forming fine conductive lines, patterns, and connectors, in particular for electronic devices. The method comprises a series of steps in which: a polymeric material is applied to a substrate; the polymeric mate­rial is patterned to form openings through, spaces within, or combinations thereof in the polymeric material; subsequently, conductive material is applied to the patterned polymeric mate­rial, so that it at least fills the openings and spaces existing in the polymeric material; and excess conductive material is removed from the exterior major surface of the polymeric material using chemical-mechanical polishing, to expose at least the exterior major surface of the polymeric material. The structure remaining has a planar exterior surface, wherein the conductive material filling the openings and spaces in the patterned polymeric mate­rial becomes features such as fine lines, patterns, and connectors which are surrounded by the polymeric material. The polymeric material may be left in place as an insulator or removed, leaving the conductive features on the substrate.

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