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公开(公告)号：DE68915835D1
公开(公告)日：1994-07-14
申请号：DE68915835
申请日：1989-01-31
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , DIMMICK ROGER FRANCIS , HALL WILLIAM ALLEN , HOMAN LESTER CHARLES , LUKES FRANK JOHN , MARTIN BRADLEY LEWIS , MOSLEY CLAUDE JOSEPH , RECKINGER ARTHUR PIERRE , SCHAEFER PAUL WILLIAM , SQUILLACE ZANTI DAVID , WESTPHAL GORDON WILBUR , WHEELER STEPHEN EDWARD
Abstract: A data processing system is shown packaged in an enclosure wherein the system frame or chassis and a cable carrier are separately fabricated and thereafter merged to provide an enclosure (11) with open ends and a central cable carrier (20) that mounts connections for the system components. The system components (22, 23) are slideably received by the enclosure and are self docking as the electrical connections with the system power and signal lines are completed as the components arrive at the fully inserted, latched position. Keying means are also provided to require the user to install the components at both the correct location and with the correct orientation.
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公开(公告)号：DE69010655D1
公开(公告)日：1994-08-18
申请号：DE69010655
申请日：1990-11-27
Applicant: IBM
Inventor： AUG CONRAD JEAN , CASANOVA WAYNE JOSEPH , CORFITS WILLIAM DALE , DIMMICK ROGER FRANCIS , WHEELER STEPHEN EDWARD
Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.
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公开(公告)号：DE69022018D1
公开(公告)日：1995-10-05
申请号：DE69022018
申请日：1990-11-27
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , CORFITS WILLIAM DALE , DIMMICK ROGER FRANCIS , THOMPSON GARY ALLEN , THORPE JAMES ROBERT , WHEELER STEPHEN EDWARD
Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).
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Patent Agency Ranking
公开(公告)号：DE69012305T2
公开(公告)日：1995-03-30
申请号：DE69012305
申请日：1990-11-27
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , RECKINGER ARTHUR PIERRE , SEYFERT MICHAEL DAVID , THORPE JAMES ROBERT , WHEELER STEPHEN EDWARD
Abstract: An enclosure is provided for containing the logic elements and ancillary components for computing systems. The enclosure is a unitized central electronics enclosure (20) (CEC) wherein the primary structural element is the enclosure for the logic elements. This enclosure or logic cage includes unitary side plates (24, 25), a double-sided backplane and top and bottom cast guides (29, 30). The integrated structural and enclosure functions accommodate the structural needs of a CEC, as well as containing and supporting the logic elements and ancillary equipment.
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公开(公告)号：DE69022018T2
公开(公告)日：1996-04-18
申请号：DE69022018
申请日：1990-11-27
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , CORFITS WILLIAM DALE , DIMMICK ROGER FRANCIS , THOMPSON GARY ALLEN , THORPE JAMES ROBERT , WHEELER STEPHEN EDWARD
Abstract: A double-sided central electronics complex (CEC) (20) is provided for increasing the logic card density in a logic cage or CEC. Specifically, two logic cages or sub-enclosures (22, 24) are integrated, sharing one backplane card so that logic elements may be plugged into the CEC from both sides. The CEC is formed by unitary sheet metal side plates, top and bottom cast or guides (26, 28) and a single double-sided backplane assembly (38).
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公开(公告)号：DE69010655T2
公开(公告)日：1995-01-12
申请号：DE69010655
申请日：1990-11-27
Applicant: IBM
Inventor： AUG CONRAD JEAN , CASANOVA WAYNE JOSEPH , CORFITS WILLIAM DALE , DIMMICK ROGER FRANCIS , WHEELER STEPHEN EDWARD
Abstract: A double-sided backplane assembly (20) is provided for increasing the logic element density in a logic cage or CEC. The backplane assembly is multi-layered with a backplane card (22) centrally located between a stiffener (30) and an EMC shield (36) affixed to each side thereof. Connectors for connecting logic elements to the backplane card are provided on both sides of the backplane card, so that a logic cage having two sub-cages may be provided, the two sub-cages sharing the one backplane assembly.
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公开(公告)号：DE68915835T2
公开(公告)日：1994-12-08
申请号：DE68915835
申请日：1989-01-31
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , DIMMICK ROGER FRANCIS , HALL WILLIAM ALLEN , HOMAN LESTER CHARLES , LUKES FRANK JOHN , MARTIN BRADLEY LEWIS , MOSLEY CLAUDE JOSEPH , RECKINGER ARTHUR PIERRE , SCHAEFER PAUL WILLIAM , SQUILLACE ZANTI DAVID , WESTPHAL GORDON WILBUR , WHEELER STEPHEN EDWARD
Abstract: A data processing system is shown packaged in an enclosure wherein the system frame or chassis and a cable carrier are separately fabricated and thereafter merged to provide an enclosure (11) with open ends and a central cable carrier (20) that mounts connections for the system components. The system components (22, 23) are slideably received by the enclosure and are self docking as the electrical connections with the system power and signal lines are completed as the components arrive at the fully inserted, latched position. Keying means are also provided to require the user to install the components at both the correct location and with the correct orientation.
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公开(公告)号：DE69012305D1
公开(公告)日：1994-10-13
申请号：DE69012305
申请日：1990-11-27
Applicant: IBM
Inventor： CASANOVA WAYNE JOSEPH , RECKINGER ARTHUR PIERRE , SEYFERT MICHAEL DAVID , THORPE JAMES ROBERT , WHEELER STEPHEN EDWARD
Abstract: An enclosure is provided for containing the logic elements and ancillary components for computing systems. The enclosure is a unitized central electronics enclosure (20) (CEC) wherein the primary structural element is the enclosure for the logic elements. This enclosure or logic cage includes unitary side plates (24, 25), a double-sided backplane and top and bottom cast guides (29, 30). The integrated structural and enclosure functions accommodate the structural needs of a CEC, as well as containing and supporting the logic elements and ancillary equipment.
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